Artificial Intelligence 101: It’s Math, Not Magic


The term artificial intelligence (AI) can be somewhat misleading. While the medium of intelligence is designed (and, in that sense, artificial or human-made), the intelligence itself is based on very real data. However, most people hear “AI” and think of futuristic robots or scenes from science fiction movies, not recognizing that the origin of AI is not fictional or magical — it’s math... » read more

New Data Management Challenges


An explosion in semiconductor design and manufacturing data, and the expanding use of chips in safety-critical and mission-critical applications, is prompting chipmakers to collect and manage that data more effectively in order to improve overall performance and reliability. This collection of data reveals a number of challenges with no simple solutions. Data may be siloed and inconsistent, ... » read more

A New Era For HPC-Driven Engineering Simulation


Market pressure and technological advancements have rapidly changed the way engineers work. Design engineers increasingly work with larger and more complex models, must conduct more frequent simulation analysis, and iterate more rapidly. Compute constraints, however, often result in engineers limiting model sizes and simulation fidelity, or relying on lengthy, overnight simulation runs. ... » read more

Blog Review: Sept. 7


Cadence's Paul McLellan shares highlights from the recent Hot Chips tutorial on CXL and how enhanced memory pooling enables new memory usage models as CXL 3.0 approaches the same speed as DRAM. Synopsys' Sam Tennent and Kamal Desai highlight the emergence of virtual prototyping, its synergy with continuous integration and development setups, and the benefits when these disciplines are combin... » read more

Design For Security Now Essential For Chips, Systems


It's nearly impossible to create a completely secure chip or system, but much can be done to raise the level of confidence about that security. In the past, security was something of an afterthought, disconnected from the architecture and added late in the design cycle. But as chips are used increasingly in safety- and mission-critical systems, and as the value of data continues to rise, the... » read more

Blog Review: Aug. 31


Cadence's Paul McLellan wonders what's happened to 450mm wafers as equipment development efforts end, the only wafer fab is decommissioned, and manufacturers see little likelihood to recoup further investment in R&D. Synopsys' Manuel Mota finds that the scale and modular flexibility of chiplets can help meet narrowing time-to-market windows and looks at how UCIe provides a complete stack... » read more

Week In Review: Design, Low Power


Quantum computing Baidu introduced a 10-qubit quantum computer called Qianshi and what it described as “the world's first all-platform quantum hardware-software integration solution that provides access to various quantum chips via mobile app, PC, and cloud.” The company said it has also completed the design of a 36-qubit quantum chip. Scientists said “levitating” nanoparticles co... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive, mobility California will ban the sale of new gasoline vehicles so that by 2035 100% of new cars and light trucks sold in California will be zero-emission vehicles. NXP Semiconductors announced multi-year supply agreements for its S32 family. Agreements to supply the S32 domain and zonal automotive processors to OEMs will include upcoming 5nm ASIL-D processors. Keysight Techno... » read more

The Next Incarnation Of EDA


The EDA industry has incrementally addressed issues as they arise in the design of electronic systems, but is there about to be a disruption? Academia is certainly seeing that as a possibility, but not all of them see it happening for the same reason. The academic community questioned the future of EDA at the recent Design Automation Conference. Rather than EDA as we know it going away, they... » read more

Blog Review: Aug. 24


Synopsys' Manuel Mota presents an overview of some of the newest multi-chip module packaging types and their advantages and disadvantages for different kinds of applications, as well as the importance of die-to-die interfaces. Cadence's Steve Brown finds that innovative products require that electronics be analyzed in the context of the environment in which they run, making mechanical and el... » read more

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