Chip Industry Technical Paper Roundup: June 9


New technical papers recently added to Semiconductor Engineering’s library: [table id=438 /] Find more semiconductor research papers here. » read more

Determinants Of Bond Wave Speed In Wafer Bonding (Yokohama, TEL)


A recent technical paper titled "Factors determining bond wave speed in wafer bonding" was published by researcher at Yokohama National University, Tokyo Electron Kyushu Limited and ANVOS Analytics. Abstract "Wafer-level direct bonding has become a critical process for advanced 3D architectures in logic, memory, and CMOS image sensors. The minimization of the wafer distortion caused by wafe... » read more