tag: AOI

Using Deep Learning ADC For Defect Classification For Automatic Defect Inspection
By Onto Innovation - 14 May, 2024 - Comments: 0

In traditional semiconductor packaging, manual defect review after automated optical inspection (AOI) is an arduous task for operators and engineers, involving review of both good and bad die. It is hard to avoid human errors when reviewing millions of defect images every day, and as a result, underkill or overkill of die can occur. Automatic defect classification (ADC) can reduce the number of... » read more

Return On Investment Of A Pre-Reflow AOI System
By Nordson Test And Inspection - 14 May, 2024 - Comments: 0

This paper describes the losses from defects at the placement process in the SMT line. Two case studies of European and Taiwanese SMT manufacturers illustrate the actual losses from their defects. An evaluation method to select a pre-reflow AOI system maximizing the return on investment (ROI) is introduced. In the end, ROIs of three commercial pre-reflow AOI systems are compared to demonstrate ... » read more

Using Automatic Defect Classification To Reduce The Escape Rate Of Defects
By Bryce Chi - 09 Apr, 2024 - Comments: 0

Automated optical inspection (AOI) is a cornerstone in semiconductor manufacturing, assembly and testing facilities, and as such, it plays a crucial role in yield management and process control. Traditionally, AOI generates millions of defect images, all of which are manually reviewed by operators. This process is not only time-consuming but error prone due to human involvement and fatigue, whi... » read more

Challenges Grow For Creating Smaller Bumps For Flip Chips
By Anne Meixner - 18 May, 2023 - Comments: 0

New bump structures are being developed to enable higher interconnect densities in flip-chip packaging, but they are complex, expensive, and increasingly difficult to manufacture. For products with high pin counts, flip-chip [1] packages have long been a popular choice because they utilize the whole die area for interconnect. The technology has been in use since the 1970s, starting with IBM�... » read more

Fabs Drive Deeper Into Machine Learning
By Anne Meixner - 07 Sep, 2021 - Comments: 0

Advanced machine learning is beginning to make inroads into yield enhancement methodology as fabs and equipment makers seek to identify defectivity patterns in wafer images with greater accuracy and speed. Each month a wafer fabrication factory produces tens of millions of wafer-level images from inspection, metrology, and test. Engineers must analyze that data to improve yield and to reject... » read more

Demand Grows For Reducing PCB Defects
By Anne Meixner - 13 Oct, 2020 - Comments: 0

Board manufacturers are boosting their investment in inspection, test and analytics to meet the increasingly stringent demands for reliability in safety-critical sectors like automotive. This represents a significant shift from the past, where concerns about reliability primarily targeted the devices connected to printed circuit boards. But as SoCs become disaggregated into advanced packages... » read more

Inspection And Metrology Of Micro LED Technology
By CyberOptics - 10 Feb, 2020 - Comments: 0

Micro LEDs developed using Rohinni’s technology can be deployed in consumer electronics devices, automotive applications and outdoor signage, among other applications. The disruptive technology enables products that are brighter, thinner, lighter and more dynamic that those currently on the market, with lower power consumption than LCD or OLED. Rohinni needed an inspection and metrology so... » read more

Test In New Frontiers: Flexible Circuits
By Susan Rambo - 12 Nov, 2019 - Comments: 0

Test is becoming increasingly complicated as new technologies such as flexible electronics begin playing mission-critical roles in applications where electronics have little or no history. Although flexible circuitry has been around for while, testing needs to catch up as these circuits are deployed across a variety of markets where conditions may be extreme. In many cases, sensors for monit... » read more

Addressing High Precision Automated Optical Inspection Challenges With 3D Technology
By CyberOptics - 08 Jul, 2019 - Comments: 0

Driven by the continued decrease in the size of electronics packaging, combined with the increase in density, there is a critical need for highly accurate 3D inspection for defect detection. Using multi-view 3D sensors and parallel projection, it is possible to capture more of the board at a faster rate as compared to serial image acquisition which is more time consuming. Precise 3D image re... » read more

Extending 3D MRS Sensor Technology To Address Challenging Measurement And Inspection Applications
By CyberOptics - 11 Jun, 2019 - Comments: 0

There is an increasing need for highly accurate 3D inspection and measurement capabilities for applications in SMT, semiconductor and metrology markets. 3D Multiple Reflection Suppression (MRS) sensor technology has been effectively combined with Automated Optical Inspection for several years and is now being utilized for many SPI applications such as microelectronics and sub-100-micron sold... » read more

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