tag: Apple

New Issues In Advanced Packaging
By Ann Mutschler - 08 Mar, 2018 - Comments: 1

Advanced packaging is gaining in popularity as the cost and complexity of integrating everything onto a planar SoC becomes more difficult and costly at each new node, but ensuring that these packaged die function properly and yield sufficiently isn't so simple. There are a number of factors that are tilting more of the the semiconductor industry toward advanced [getkc id="27" kc_name="packag... » read more

Is Advanced Packaging The Next SoC?
By Ed Sperling - 05 Mar, 2018 - Comments: 1

Device scaling appears to be possible down to 1.2nm, and maybe even beyond that. What isn't obvious is when scaling will reach that node, how many companies will actually use it, or even what chips will look like when foundries actually start turning out these devices using multi-patterning with high-NA EUV and dielectrics with single-digit numbers of atoms. There are two big changes playing... » read more

Toward High-End Fan-Outs
By Ed Sperling - 05 Mar, 2018 - Comments: 1

Foundries and OSATs are working on more advanced fan-outs, including some with vertically stacked die inside the package, filling a middle ground between lower-cost fan-outs and systems in package on one side and 2.5D and 3D-ICs on the other. These new [getkc id="202" kc_name="fan-outs"] have denser interconnects than previous iterations, and in some cases they include multiple routing layer... » read more

Wireless Charging Creeps Forward
By Kevin Fogarty - 28 Feb, 2018 - Comments: 1

It's well known that electricity can travel long distances through the air, but expanding beyond the boundaries of a wire has never seemed a practical or reliable way to power delicate electronics. In fact, wireless power has been widely available for years. Whether this approach will be used to extend battery life isn't entirely clear. But it is attracting renewed attention as the balance b... » read more

FD-SOI Adoption Expands
By Ed Sperling - 21 Feb, 2018 - Comments: 2

Fully depleted silicon-on-insulator (FD-SOI) is gaining ground across a number of new markets, ranging from IoT to automotive to machine learning, and diverging sharply from its original position as a less costly alternative to finFET-based designs. For years, [getkc id="220" kc_name="FD-SOI"] has been viewed as an either/or solution targeted at the same markets as bulk [gettech id="31093" c... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 16 Feb, 2018 - Comments: 0

Fab tools and test Applied Materials reported record revenue and operating profit in its first quarter ended Jan. 28. Compared to the first quarter of fiscal 2017, Applied grew net sales by 28% to $4.20 billion. In the second quarter of fiscal 2018, Applied expects net sales to be in the range of $4.35 billion to $4.55 billion. “AMAT posted F1Q results above guidance as NAND demand, in p... » read more

Fan-Out Wars Begin
By Mark LaPedus - 05 Feb, 2018 - Comments: 3

Several packaging houses are developing the next wave of high-density fan-out packages for premium smartphones, but perhaps a bigger battle is brewing in the lower density fan-out arena. Amkor, ASE, STATS ChipPAC and others sell traditional low-density fan-out packages, although some new and competitive technologies are beginning to appear in the market. Low-density fan-out, or sometimes cal... » read more

Deep Learning Spreads
By Ed Sperling - 31 Jan, 2018 - Comments: 0

Deep learning is gaining traction across a broad swath of applications, providing more nuanced and complex behavior than machine learning offers today. Those attributes are particularly important for safety-critical devices, such as assisted or autonomous vehicles, as well as for natural language processing where a machine can recognize the intent of words based upon the context of a convers... » read more

What’s Next in 3D NAND?
By Mark LaPedus - 18 Jan, 2018 - Comments: 1

In 2018, the industry needs to keep a close eye on 3D NAND as the vendor base is in the midst of some major changes. The changes involve several partnerships, including the Toshiba/Western Digital and Intel/Micron duos. It also impacts the other 3D NAND players, namely Samsung and SK Hynix. But first, demand for NAND flash memory remains robust due to the onslaught of data in systems. ... » read more

Packaging Challenges For 2018
By Mark LaPedus - 08 Jan, 2018 - Comments: 0

The IC packaging market is projected to see steady growth this year, amid ongoing changes in the landscape. The outsourced semiconductor assembly and test ([getkc id="83" kc_name="OSAT"]) industry, which provides third-party packaging and test services, has been consolidating for some time. So while sales rising, the number of companies is falling. In late 2017, for example, [getentity id="2... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy