tag: Apple

The Week In Review: Manufacturing
By Mark LaPedus - 29 Dec, 2017 - Comments: 0

Chipmakers Christopher Rolland, an analyst at Susquehanna International, expects to see more merger and acquisition activity in the IC industry heading into 2018. “M&A activity slowed in 2017, but the year is going out with a bang!” Rolland said in a recent research note. Towards the end of 2017, for example, Broadcom made a bid for Qualcomm, while Marvell announced intent to buy Cavium. ... » read more

The Week in Review: IoT
By Jeff Dorsch - 22 Dec, 2017 - Comments: 0

Finance Robert Bosch Venture Capital has purchased a significant number of IOTA tokens from the IOTA Foundation, making a cryptocurrency investment in blockchain technology and the Internet of Things. IOTA provides distributed ledger technology, enabling secure machine-to-machine transactions in data and money, with the foundation charging a micro fee for the service. Riot Blockchain report... » read more

Preparing For Bigger Changes Ahead
By Ed Sperling - 21 Dec, 2017 - Comments: 0

The semiconductor industry has undergone a fundamental shift over the past year, and it's one that will redefine chipmaking over the next decade or more. While the focus is still on building the fastest, lowest-power devices, whether that's by shrinking features or packaging them into blazing-fast 2.5D or fan-out configurations, these devices are being customized for specific use cases much ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 15 Dec, 2017 - Comments: 0

Chipmakers Apple has announced the latest award from its $1 billion Advanced Manufacturing Fund. Finisar, a manufacturer of optical communications components, will receive $390 million in funds from Apple. The award will enable Finisar to increase its R&D spending and high-volume production of vertical-cavity surface-emitting lasers (VCSELs). A VCSEL is a type of semiconductor laser diode. The... » read more

The Week in Review: IoT
By Jeff Dorsch - 15 Dec, 2017 - Comments: 1

Products/Services NXP Semiconductors is partnering with Alibaba Cloud, the cloud computing business unit of Alibaba Group, to develop secure smart devices for edge computing. The companies will also work together on Internet of Things offerings. AliOS, the Alibaba IoT operating system, has been integrated with NXP’s application processors, microcontrollers, and Layerscape multicore processor... » read more

Fan-Outs vs. TSVs
By Jeff Dorsch - 13 Dec, 2017 - Comments: 0

Two years ago, at the annual IMAPS conference on 2.5D and 3D chip packaging, the presentations were dominated by talk of fan-out wafer-level packaging. There was almost no talk of through-silicon vias, which previously had been heralded as vital to 2.5D and 3DIC packaging. Fast forward to this month's 3D Architectures for Heterogeneous Integration and Packaging conference in Burlingame, Cali... » read more

Advanced Packaging Is Suddenly Very Cool
By Ed Sperling - 11 Dec, 2017 - Comments: 2

The hottest chip markets today—automotive AI for autonomous and heavily assisted driving, machine learning, virtual and augmented reality—all are beginning to look at advanced packaging as the best path forward for improving performance and reducing power. Over the past four years, which is when 2.5D and fan-out wafer-level packaging first really began garnering interest, these and othe... » read more

Shortages Hit Packaging Biz
By Mark LaPedus - 11 Dec, 2017 - Comments: 1

Rising demand for chips is hitting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, leadframes and even some equipment. Spot shortages for some IC packages began showing up earlier this year, but the problem has been growing and spreading since then. Supply imbalances reached a boiling point in the third and fourth quarters of this yea... » read more

The IoT Is Alive And Well
By Ed Sperling - 07 Dec, 2017 - Comments: 0

There has been a lot of grumbling lately about the IoT and how it has failed to live up to expectations. But the problem may be less about the success of the IoT than the ability of any group of chipmakers and manufacturers to capitalize on its success. The IoT has been growing steadily since the term was first coined by Kevin Ashton, who began using RFID inside of Procter & Gamble to ma... » read more

A Better Way To Connect The Home
By Sree Durbha - 07 Dec, 2017 - Comments: 0

The concept of a fully ‘connected home’ has been discussed for more than 20 years. However, widespread proliferation has taken far longer than anyone could have originally imagined. For a long time, deployment activity seemed to be limited to a relatively small number of high value installations. These installations were generally complicated to implement and their operation was not very us... » read more

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