tag: Apple

Fan-Out Wars Begin
By Mark LaPedus - 05 Feb, 2018 - Comments: 3

Several packaging houses are developing the next wave of high-density fan-out packages for premium smartphones, but perhaps a bigger battle is brewing in the lower density fan-out arena. Amkor, ASE, STATS ChipPAC and others sell traditional low-density fan-out packages, although some new and competitive technologies are beginning to appear in the market. Low-density fan-out, or sometimes cal... » read more

Deep Learning Spreads
By Ed Sperling - 31 Jan, 2018 - Comments: 0

Deep learning is gaining traction across a broad swath of applications, providing more nuanced and complex behavior than machine learning offers today. Those attributes are particularly important for safety-critical devices, such as assisted or autonomous vehicles, as well as for natural language processing where a machine can recognize the intent of words based upon the context of a convers... » read more

What’s Next in 3D NAND?
By Mark LaPedus - 18 Jan, 2018 - Comments: 1

In 2018, the industry needs to keep a close eye on 3D NAND as the vendor base is in the midst of some major changes. The changes involve several partnerships, including the Toshiba/Western Digital and Intel/Micron duos. It also impacts the other 3D NAND players, namely Samsung and SK Hynix. But first, demand for NAND flash memory remains robust due to the onslaught of data in systems. ... » read more

Packaging Challenges For 2018
By Mark LaPedus - 08 Jan, 2018 - Comments: 0

The IC packaging market is projected to see steady growth this year, amid ongoing changes in the landscape. The outsourced semiconductor assembly and test ([getkc id="83" kc_name="OSAT"]) industry, which provides third-party packaging and test services, has been consolidating for some time. So while sales rising, the number of companies is falling. In late 2017, for example, [getentity id="2... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 29 Dec, 2017 - Comments: 0

Chipmakers Christopher Rolland, an analyst at Susquehanna International, expects to see more merger and acquisition activity in the IC industry heading into 2018. “M&A activity slowed in 2017, but the year is going out with a bang!” Rolland said in a recent research note. Towards the end of 2017, for example, Broadcom made a bid for Qualcomm, while Marvell announced intent to buy Cavium. ... » read more

The Week in Review: IoT
By Jeff Dorsch - 22 Dec, 2017 - Comments: 0

Finance Robert Bosch Venture Capital has purchased a significant number of IOTA tokens from the IOTA Foundation, making a cryptocurrency investment in blockchain technology and the Internet of Things. IOTA provides distributed ledger technology, enabling secure machine-to-machine transactions in data and money, with the foundation charging a micro fee for the service. Riot Blockchain report... » read more

Preparing For Bigger Changes Ahead
By Ed Sperling - 21 Dec, 2017 - Comments: 0

The semiconductor industry has undergone a fundamental shift over the past year, and it's one that will redefine chipmaking over the next decade or more. While the focus is still on building the fastest, lowest-power devices, whether that's by shrinking features or packaging them into blazing-fast 2.5D or fan-out configurations, these devices are being customized for specific use cases much ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 15 Dec, 2017 - Comments: 0

Chipmakers Apple has announced the latest award from its $1 billion Advanced Manufacturing Fund. Finisar, a manufacturer of optical communications components, will receive $390 million in funds from Apple. The award will enable Finisar to increase its R&D spending and high-volume production of vertical-cavity surface-emitting lasers (VCSELs). A VCSEL is a type of semiconductor laser diode. The... » read more

The Week in Review: IoT
By Jeff Dorsch - 15 Dec, 2017 - Comments: 1

Products/Services NXP Semiconductors is partnering with Alibaba Cloud, the cloud computing business unit of Alibaba Group, to develop secure smart devices for edge computing. The companies will also work together on Internet of Things offerings. AliOS, the Alibaba IoT operating system, has been integrated with NXP’s application processors, microcontrollers, and Layerscape multicore processor... » read more

Fan-Outs vs. TSVs
By Jeff Dorsch - 13 Dec, 2017 - Comments: 0

Two years ago, at the annual IMAPS conference on 2.5D and 3D chip packaging, the presentations were dominated by talk of fan-out wafer-level packaging. There was almost no talk of through-silicon vias, which previously had been heralded as vital to 2.5D and 3DIC packaging. Fast forward to this month's 3D Architectures for Heterogeneous Integration and Packaging conference in Burlingame, Cali... » read more

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