tag: Apple

Fix Processes, Then Silos
By Ed Sperling - 09 Feb, 2017 - Comments: 0

Jack Welch, former CEO of GE, was a big proponent of what he called a "boundaryless corporation." It was a good sound bite, but it pales in comparison to former Intel CEO Andy Grove's philosophy of working out of a cubicle, just like the rest of his staff. While it's great to have corporate buy-in for breaking down silos, which are vertically integrated, the real problem for semiconductor c... » read more

OSAT Biz: Growth And Challenges
By Mark LaPedus - 08 Feb, 2017 - Comments: 0

Amid a challenging business environment, the outsourced semiconductor assembly and test (OSAT) industry is projected to see steady to strong growth in a number of packaging segments this year. Right now, the [getkc id="83" kc_name="OSATs"]—which provide third-party IC-packaging and test services—are seeing brisk demand for both legacy and advanced chip packages. In addition, IDMs continu... » read more

More Degrees Of Freedom
By Ed Sperling - 06 Feb, 2017 - Comments: 0

Ever since the publication of Gordon Moore's famous observation in 1965, the semiconductor industry has been laser-focused on shrinking devices to their practical, and more recently, impractical limit. Increasing transistor density has encountered a number of problems along the way, but it also has enabled us to put computers—which once filled specially built rooms—onto the desktop firs... » read more

Betting On Wafer-Level Fan-Outs
By Ed Sperling - 06 Feb, 2017 - Comments: 2

Advanced packaging is starting to gain traction as a commercially viable business model rather than just one more possible option, propelled by the technical difficulties in routing signals at 10nm and 7nm and skyrocketing costs of device scaling on a single die. The inclusion of a [getkc id="202" kc_name="fan-out"] package for logic in Apple's iPhone 7, based on TSMC's Integrated Fan-Out (... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 03 Feb, 2017 - Comments: 0

Manufacturing Veeco Instruments has signed a definitive agreement to acquire Ultratech. With the deal, Veeco will enter into the lithography market for chip-packaging as well as the laser spike anneal business. Veeco is a supplier of MOCVD tools. The implied total transaction value is approximately $815 million and the implied enterprise value is approximately $550 million. FlexTech, a SE... » read more

Bidding War On H-1B Visas?
By Ed Sperling - 26 Jan, 2017 - Comments: 3

Good help is hard to find. It's about to get harder—and more expensive. The U.S. tech industry's solution until now has been to leverage expertise from around the world, drawing top graduates and entry-level professionals under the H-1B visa program. Last year, there were 85,000 H-1B visas issued, of which 20,000 are required to hold a U.S. master's degree or higher. There are some exce... » read more

The Week In Review: IoT
By Jeff Dorsch - 20 Jan, 2017 - Comments: 0

Products Intel on Monday unveiled the Responsive Retail Platform, with CEO Brian Krzanich making a presentation at the National Retail Federation’s Big Show conference. “Intel’s Internet of Things (IoT) and cloud technologies touch every link of the retail supply chain. IoT sensors capture data that can be analyzed. Data centers crunch the information and give it real-world usefulness,�... » read more

IoT Security Risks Grow
By Ed Sperling - 09 Jan, 2017 - Comments: 0

Semiconductor Engineering sat down to discuss security issues with Asaf Shen, vice president of marketing for security IP in ARM's Systems & Software Group; Timothy Dry, principal staff marketing manager for the Industrial IoT segment at GlobalFoundries; Chowdary Yanamadala, senior vice president of business development at ChaoLogix; and Eric Sivertson, CEO of Quantum Trace. What follows ar... » read more

The Week In Review: IoT
By Jeff Dorsch - 23 Dec, 2016 - Comments: 0

M&A TDK has agreed to acquire InvenSense for $13 a share, representing a total of $1.3 billion in cash. The transaction must be approved by InvenSense shareholders and regulatory agencies; TDK expects to wrap up the deal in the second quarter of its fiscal year ending in March of 2018 (the third quarter of the calendar year). Apple accounted for 40% of InvenSense’s revenue for the fiscal... » read more

What’s Missing In Advanced Packaging
By Ann Mutschler - 22 Dec, 2016 - Comments: 0

Even though Moore's Law is running out of steam, there is still a need to increase functional density. Increasingly, this is being done with heterogeneous integration at the package or module level. This is proving harder than it looks. At this point there are no standardized methodologies, and tools often are retrofitted versions of existing tools that don't take into account the challenges... » read more

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