tag: Apple

The Week In Review: Manufacturing
By Mark LaPedus - 07 Apr, 2017 - Comments: 0

Mask and fab equipment Seeking to speed up the semiconductor design and manufacturing process, D2S has rolled out its fifth-generation computational design platform (CDP). D2S, a supplier of GPU-accelerated computational systems or platforms, said the latest CDP is designed to enable faster simulations for a range of applications. Using Nvidia’s Pascal-based Tesla P40 GPUs, D2S’ fifth-... » read more

The Week In Review: Design
By Jesse Allen - 07 Apr, 2017 - Comments: 0

Name Changes Arteris changed its name to ArterisIP. The company said the name change better reflects what the company does, which is provide IP for SoC communication on-die and between die. Mentor Graphics also modified its name, following last week's announcement that the acquisition by Siemens has been completed. The company is now officially called Mentor, A Siemens Business. It also ... » read more

Pushing Batteries Too Far?
By Ed Sperling - 06 Apr, 2017 - Comments: 0

Reports of battery fires in consumer devices are not abating. The culprit in almost all cases is the lithium-ion battery. In some cases, this is a manufacturing issue, where predictable intervals of failure can point to a breach in the membrane separating the anode and cathode or a metal particle contaminant that causes a short circuit. Those kinds of flaws are well understood, based upon ho... » read more

IoT Security Risks Grow
By Ed Sperling - 30 Mar, 2017 - Comments: 0

Semiconductor Engineering sat down to discuss security issues with Asaf Shen, vice president of marketing for security IP in [getentity id="22186" e_name="ARM's"] Systems & Software Group; Timothy Dry, principal staff marketing manager for the Industrial IoT segment at [getentity id="22819" comment="GlobalFoundries"]; Chowdary Yanamadala, senior vice president of business development at Cha... » read more

When Will It Be Done?
By Ed Sperling - 23 Mar, 2017 - Comments: 0

Design teams have done remarkably well in getting chips out the door on time, despite growing complexity at each new node and an increase in the number of features and IP blocks that need to be integrated into designs. There has been plenty of grumbling, along with dire warnings about the future of Moore's Law and the impact of industry consolidation. The reality, though, is that the volume ... » read more

MEMS Microphones: A Bright Spot Among Commoditized Consumer Sensors
By Jun Yan - 16 Mar, 2017 - Comments: 0

MEMS microphones have emerged as a bright spot among consumer sensors, which in general are going through a rapid commoditization and profit-squeezing trend. To understand what’s driving the MEMS microphone market, consider that the Apple iPhone 7 and 7S each have 4 MEMS microphones. As reported by System Plus Consulting, the latest iPhones have “a front-facing top microphone, presumably f... » read more

Antenna Design Grows Up
By Ann Mutschler - 09 Mar, 2017 - Comments: 2

Apple’s iPhone 4 antenna issue represents a classic example of what can go wrong in modern antenna design. Put one in the wrong place, and a seemingly insignificant part can turn a cool new product into a public relations nightmare. Ever since antennas dropped out of sight, most consumers don't give them a second thought. In the 1960s, almost every home had a rooftop antenna. Fast forward ... » read more

Testing For Security
By Ed Sperling - 06 Mar, 2017 - Comments: 0

Ever since the IoT became a household name, people have been strategizing about ways to utilize non-secure devices to mount an attack. The first instances of using electricity to overload a device's circuits, thereby neutralizing existing security features, came to light in some of the earliest car hacking incidents. These are basically side-channel attacks using what amounts to an electroni... » read more

Quality Issues Widen
By Ed Sperling - 06 Mar, 2017 - Comments: 0

As the amount of semiconductor content in cars, medical and industrial applications increases, so does the concern about how long these devices will function properly—and what exactly that means. Quality is frequently a fuzzy concept. In mobile phones, problems have ranged from bad antenna placement, which resulted in batteries draining too quickly, to features that take too long to load. ... » read more

What Next For OSATs
By Mark LaPedus - 06 Mar, 2017 - Comments: 0

Semiconductor Engineering sat down to discuss IC-packaging and business trends with Tien Wu, chief operating officer at Taiwan’s Advanced Semiconductor Engineering ([getentity id="22930" comment="ASE"]), the world’s largest outsourced semiconductor assembly and test (OSAT) vendor. What follows are excerpts of that conversation. SE: What’s the outlook for the IC industry in 2017? Wu:... » read more

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