Chip-Last HDFO (High-Density Fan-Out) Interposer-PoP

By Amkor - 17 Feb, 2022 - Comments: 0

Interposer Package-on-Package (PoP) technology was developed and has been in very high-volume production over the last several years for high-end mobile application processors (APs). This is due to its advantages of good package design flexibility, controllable package warpage at room temperature (25°C) and high temperature (260°C), reduced assembly manufacturing cycle time and chip-last asse... » read more

End In Sight For Chip Shortages?

By Mark LaPedus - 18 Nov, 2021 - Comments: 2

The current wave of semiconductor and IC packaging shortages is expected to extend well into 2022, but there are also signs that supply may finally catch up with demand. The same is true for manufacturing capacity, materials and equipment in both the semiconductor and packaging sectors. Nonetheless, after a period of shortages in all segments, the current school of thought is that chip suppl... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 10 Aug, 2018 - Comments: 0

Cybersecurity Jens (Atom) Steube, a cybersecurity researcher and creator of the Hashcat password cracking tool, was probing for vulnerabilities in the new WPA3 security standard for Wi-Fi routers. WPA3 presents a robust defense against hacking, yet Steube discovered a security flaw in routers using WPA/WPA2 – one that leaves Wi-Fi passwords enabled with Pairwise Master Key Identifiers vulner... » read more

The Week in Review: IoT

By Jeff Dorsch - 15 Dec, 2017 - Comments: 1

Products/Services NXP Semiconductors is partnering with Alibaba Cloud, the cloud computing business unit of Alibaba Group, to develop secure smart devices for edge computing. The companies will also work together on Internet of Things offerings. AliOS, the Alibaba IoT operating system, has been integrated with NXP’s application processors, microcontrollers, and Layerscape multicore processor... » read more

The Week In Review: IoT

By Jeff Dorsch - 28 Apr, 2017 - Comments: 0

Finance SENSORO reports receiving $18 million in Series B funding from Robert Bosch Venture Capital, Sumitomo, and Tsing Capital. Nokia Growth Partners provided $10 million in first-round financing two years ago. SENSORO, which provides Internet of Things sensor devices and network technology, was established in 2013 as part of the Microsoft Accelerator program. Daylight Investors of Los An... » read more

Mobile Processors Move Beyond Phones

By Jeff Dorsch - 12 Jan, 2017 - Comments: 0

Mobile processors, also known as application processors, are well-known as the engines that run smartphones, tablet computers, and other wireless devices. But these chips increasingly are finding their way into autonomous vehicles, the Internet of Things, unmanned aerial vehicles, virtual reality, and other applications far beyond phone calls and text messages. Moreover, they are gaining in com... » read more

Counting By The Billions

By Ed Sperling - 29 Oct, 2015 - Comments: 1

The semiconductor industry has been on cruise control since the advent of the personal computer. By 2002, a total of 1 billion PCs had been shipped, according to Gartner, and by 2008 that number had doubled. But that was nothing compared with the smartphone. In 2014 alone, Gartner reported sales of 1.2 billion smartphones. Both of those markets will remain healthy for years to come. Despite... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer