tag: Applied Materials

Applied Materials And Tokyo Electron Unveil Eteris
By Kevin Winston - 17 Jul, 2014 - Comments: 1

By Kevin Winston Applied Materials and Tokyo Electron (TEL) achieved another important milestone, unveiling the name of our combined company—Eteris [pronounced: eh-TAIR-iss]. Tetsuro Higashi, chairman and CEO of TEL, and Gary Dickerson, president and CEO of Applied Materials, revealed the new company name and logo to an enthusiastic crowd assembled for Applied’s annual analyst briefing ... » read more

Mid-Year Market Review: A Tale Of Two Halves
By Jim Feldhan - 17 Jul, 2014 - Comments: 0

The month of July brings 110-degree weather to Phoenix and a welcome trip to San Francisco for Semicon West. It also means the year is half over and it’s time to assess mid-year market dynamics. Spirits were high last week at Semicon West. Most equipment vendors made significant revenue gains in the first half of 2014 and expect the second half of the year to be just as good or even bette... » read more

Will 7nm And 5nm Really Happen?
By Mark LaPedus - 14 Jul, 2014 - Comments: 2

Today’s silicon-based finFETs could run out of steam at 10nm. If or when chipmakers move beyond 10nm, IC vendors will require a new transistor architecture. III-V finFETs, gate-all-around FETs, quantum well finFETs, SOI finFETs and vertical nanowires are just a few of the future transistor candidates at 7nm and 5nm. Technically, it’s possible to manufacture the transistor portions of the... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 11 Jul, 2014 - Comments: 0

As feature sizes continue to shrink and new device architectures are introduced, the IC industry will require new breakthroughs. In fact, feature dimensions will soon have tolerances that are on the order of a few atoms. For the most advanced structures, conventional plasma etch and deposition processes are unable to meet these requirements. As a result, the industry will require tools th... » read more

Stacked Die Are Coming Soon. Really
By Ed Sperling - 10 Jul, 2014 - Comments: 3

Since the beginning of the decade there have been many predictions that stacked die were just over the hill, but the time it has taken to climb that hill has been longer than most people would have anticipated. In fact, TSMC has been fully capable of building stacked die since last year, with risk production expected to be completed by year, according to Gartner. But something very fundament... » read more

Blog Review: July 9
By Ed Sperling - 09 Jul, 2014 - Comments: 0

Cadence’s Richard Goering walks through a keynote speech from DAC, which was delivered by Imagination Technologies’ Peter McGuinness, about the evolving role of image processing and what it can do. There are lots of changes ahead in this space. Who’s financing the Internet of Things and what are they funding? ARM’s Brad Nemire takes a look at oort, a Bluetooth hub that looks like a ... » read more

Manufacturing Bits: July 8
By Mark LaPedus - 08 Jul, 2014 - Comments: 1

Intel foundry deal At the Semicon West trade show in San Francisco, Intel announced that it has entered into a foundry agreement with Panasonic’s LSI Business Division. Intel's custom foundry business will manufacture future Panasonic system-on-chips (SoCs) using Intel's 14nm low-power manufacturing process. Intel’s low-power process will be a derivative of its general-purpose 14nm proc... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 03 Jul, 2014 - Comments: 0

Looking to address a new wave of chip architectures in the marketplace, Applied Materials has rolled out its next-generation, medium-current ion implanter. The system, dubbed the VIISta 900 3D, is geared for the production of finFETs and 3D NAND designs at the sub-2xnm nodes. Typically, medium-current implanters have a maximum energy range of about 900keV (triple-charge), with dose ranges fr... » read more

Blog Review: July 2
By Ed Sperling - 02 Jul, 2014 - Comments: 0

Mentor’s Nazita Saye has reservations about driverless cars. Sometimes it’s actually fun to drive—and sometimes it isn’t. Cadence’s Brian Fuller is a bit more optimistic about driverless cars. He says that from the standpoint of safety, efficiency and environment, autonomous vehicles will be a big step forward—if and when some critical problems are solved. And along the same... » read more

What Comes Next?
By SEMI - 27 Jun, 2014 - Comments: 0

The latest manufacturing, materials and production developments for emerging and adjacent markets will be featured at SEMICON West 2014 (www.semiconwest.org), to be held on July 8-10 at the Moscone Center in San Francisco, Calif. The co-location of emerging and adjacent market focused exhibitors and technical presentations within the framework of SEMICON West maximizes the synergies between sem... » read more

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