tag: Applied Materials

What If EUV Fails?
By Mark LaPedus - 17 Apr, 2014 - Comments: 2

It’s the worst kept secret in the industry, but extreme ultraviolet (EUV) lithography will likely miss the 10nm node. So, chipmakers will likely extend and use today’s 193nm immersion lithography down to 10nm. This, of course, will require a complex and expensive multiple patterning scheme. Now, chipmakers are formulating their lithography strategies for 7nm and beyond. As it stands now,... » read more

Time To Revisit 2.5D And 3D
By Mark LaPedus - 17 Apr, 2014 - Comments: 2

Chipmakers are reaching various and challenging inflection points. In logic, many IC makers face a daunting transition from planar transistors at 20nm to finFETs at 14nm. And on another front, the industry is nearing the memory bandwidth wall. So perhaps it’s time to look at new alternatives. In fact, chipmakers are taking a hard look, or re-examining, one alternative—stacked 2.5D/3D chi... » read more

Favorite Forecast Fallacies
By Barry Pangrle - 14 Apr, 2014 - Comments: 0

It’s difficult to make predictions, especially about the future. – An Old Danish Proverb. The GSA Silicon Summit was held on Thursday, April 10th at the Computer History Museum in Mountain View, CA. The opening panel session was entitled Advancements in Nanoscale Processing. The panelists were Rob Aitken (ARM), Adam Brand (Applied Materials), Peter Huang (TSMC), Nick Kepler (VLSI Researc... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 11 Apr, 2014 - Comments: 0

Don't look now, but the fab tool market is slowing. "After recent meetings in the supply chain plus examining comments from the largest spenders, we conclude that wafer fab equipment (WFE) could disappoint this year. We calculate approximately $30 billion to $31 billion in WFE spending in 2014, flattish from 2013, compared to expectations of $32 billion to $33 billion, which would be up 10%+. T... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 04 Apr, 2014 - Comments: 1

GlobalFoundries has emerged as the leading candidate to buy IBM's semiconductor unit, according to Reuters, which cited the Wall Street Journal as it source. IBM, which recently put its semiconductor unit on the block, has held discussions with GlobalFoundries, Intel and Taiwan Semiconductor Manufacturing Co. Ltd. GlobalFoundries did not respond to the reports by press time. GlobalFoundries ... » read more

Blog Review: April 2
By Ed Sperling - 02 Apr, 2014 - Comments: 0

Mentor’s Nazita Saye compares roadway roundabouts to networked systems. One roundabout works fine, but add in a bunch of them and you have a massive traffic jam. How many roundabouts are in your design? Cadence’s Richard Goering interviews Stan Kroliskoski, chair of the IEEE Design Automation Standards Committee, about four working groups on EDA standards and what’s ahead. Speaking ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 28 Mar, 2014 - Comments: 0

RBC Capital Markets has raised its iPhone unit forecast for 2014 to 159.1 million from 156.7 million. The iPhone estimates reflect better-than-expected growth in the September quarter, according to RBC. So which chipmakers will benefit? In order, the companies with the most exposure into Apple are Cirrus Logic, Dialog Semiconductor, Triquint, Skyworks, Audience, Avago, Broadcom, Qualcomm, SanDi... » read more

Blog Review: March 26
By Ed Sperling - 26 Mar, 2014 - Comments: 0

Synopsys’ Eric Huang has discovered a video of Superman using a GoPro camera (scroll down to bottom of page). So this is what it’s like to stop bullets with your hand. Cadence’s Tom Hackett zeroes in on mobile interfaces in a video—SoC fabric, memory and chip-to-chip. Nice whiteboard drawing. Mentor’s Anil Khanna looks at a methodology for developing high-performance embedded so... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 21 Mar, 2014 - Comments: 0

A market research firm once said if you want to sell a lot of market studies, you have to report big numbers. And some competitors have done just that, according to Will Strauss, president of Forward Concepts. In fact, some research houses inflated their smartphone shipment numbers, saying that the figure reached 1 billion in 2013, Strauss said. So, did 1 billion smartphones really ship last ye... » read more

Directed Self-Assembly Gains Momentum
By Mark LaPedus - 20 Mar, 2014 - Comments: 0

At last year’s SPIE Advanced Lithography symposium, directed self-assembly (DSA) grabbed the spotlight as chipmakers provided the first glimpse of their initial work and results with the technology. The results were stunning, thereby propelling DSA from a curiosity item to a possible patterning solution for next-generation devices. Last year, in fact, GlobalFoundries, IBM, Intel and Sams... » read more

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