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Changes In The Cloud


I wrapped up an exciting week last Friday at the inaugural NFV World Congress at the Doubletree Hotel in San Jose last week, where more than 1,000 stakeholders had gathered to convey, debate, discuss and learn about the vision for the next-generation cloud and networking infrastructure. One of the highlights of the week was the OPNFV mini-summit to communicate the tremendous progress that t... » read more

The Week In Review: Design/IoT


Embedded Mentor Graphics released a new version of their Nucleus RTOS with a focus on high-performance IoT and wearable applications. Updates include support for Dynamic Linking and Loading (DLL) capabilities in Cortex-M based cores; the ability for developers to reconfigure, update, and provision connected embedded devices that utilize cloud-based remote software services; and TI WiLink 8 m... » read more

Game Of Eco Systems


My first ever blog post on May 28, 2008, was called “May you live in interesting times …”, starting with “the view from the top” at Synopsys. At the time, my focus was abstraction levels and how the industry has been moving upwards for decades. While it is not a Chinese proverb after all (read my blog above), we still do live in interesting times, perhaps more so that ever. One of the... » read more

Rethinking Big Iron


By Ann Steffora Mutschler One size does not fit all when it comes to the server market, and that may be the best option for low-power processor makers to gain a toehold in a world that until now has been almost laser-focused on performance. Even higher-performance versions of low-power processing architectures are starting to show up inside of datacenters. Many are application-specific ... » read more

Experts At The Table: The Growing Signoff Headache


By Ed Sperling Low-Power/High-Performance Engineering sat down to discuss signoff issues with Rob Aitken, an ARM fellow; Sumbal Rafiq, director of engineering at Applied Micro; Ruben Molina, product marketing director for timing signoff at Cadence; Carey Robertson, director of product marketing for Calibre extraction at Mentor Graphics; and Robert Hoogenstryd, director of marketing for design ... » read more

Experts At The Table: The Growing Signoff Headache


By Ed Sperling Low-Power/High-Performance Engineering sat down to discuss signoff issues with Rob Aitken, an ARM fellow; Sumbal Rafiq, director of engineering at Applied Micro; Ruben Molina, product marketing director for timing signoff at Cadence; Carey Robertson, director of product marketing for Calibre extraction at Mentor Graphics; and Robert Hoogenstryd, director of marketing for design... » read more

Roundtable: Is The Chip Ready


Mobile devices demand complex chips—so complex to build that signoff has become something of a balancing act between what the verification teams believe is good enough and time-to market demands. Low-Power/High-Performance Engineering talked about this with Simbal Rafiq, director of engineering at Applied Micro; Robert Hoogenstryd, senior director of marketing for design analysis and signoff ... » read more

Experts At The Table: The Growing Signoff Headache


By Ed Sperling Low-Power/High-Performance Engineering sat down to discuss signoff issues with Rob Aitken, an ARM fellow; Sumbal Rafiq, director of engineering at Applied Micro; Ruben Molina, product marketing director for timing signoff at Cadence; Carey Robertson, director of product marketing for Calibre extraction at Mentor Graphics; and Robert Hoogenstryd, senior director of marketing for ... » read more

Performance Plus Lower Power


By Pallab Chatterjee Power and performance often have been seen as something of a tradeoff. Chipmakers focus on one or the other, or they extract a little improvement in both at each new process node. That way of thinking is changing, though. At the recent Linley processor conference, the central theme for both standalone and embedded processors was that architectures have to optimized for ... » read more