The Week In Review: Manufacturing

Chipmakers At this week’s International Wafer-Level Packaging Conference (IWLPC), Samsung disclosed details about its efforts in the panel-level fan-out market. Samsung as well as ASE, Nepes and others are developing a next-generation fan-out technology using a panel-level format. In panel-level fan-out packaging, you can put more die on a panel as compared to a traditional round wafer, w... » read more

The Week In Review: Design/IoT

IP Synopsys unveiled a line of vision processor IP cores optimized for high-performance embedded vision applications. The processors can be used with any host processors, sport multiple cores and implement a convolutional neural network to deliver more than 1000 GOPS/W, plus a software programming environment that supports OpenVX and OpenCV libraries. Deals Andes Technology and eMemory Tec... » read more

The Power Of 3D

By Cheryl Ajluni Much to the dismay of anyone who recently splurged on a new Blu-ray disk player or flat-panel HDTV, 3D stereoscopic content has become the talk of the town or, in this case, the 2010 Consumer Electronics Show. Sure, we’ve been down this road before. After all, 3D is nothing new. But it now appears ready to explode into the home in the form of 3D television (Figure 1). Bol... » read more