Week in Review: IoT, Security, Auto

By Jeff Dorsch - 31 Aug, 2018 - Comments: 1

Internet of Things Electrolux, Haier, LG Electronics, and Samsung Electronics announced they are working with the Open Connectivity Foundation, an Internet of Things standards body, to build, commercialize, and deploy interoperable OCF-Certified connected products during 2019. In addition, the OCF is launching an enhanced security model and secure cloud management capabilities, making use of p... » read more

Safety in SoCs

By Synopsys - 09 Dec, 2015 - Comments: 0

Today’s system-on-chip (SoC) designs are becoming more complex, increasing the pressure on verification and design teams to deliver fully functional designs. Recent studies have shown that over 50% of the development time on a complex IC is now being spent on verification, revealing the severity of the problem project teams are facing. As more SoC designs are used in electronic systems deploy... » read more

Using Multicore Processors To Accelerate Your High-Performance Embedded Linux Applications

By Mike Thompson - 06 Nov, 2014 - Comments: 0

The adoption of Linux is accelerating, as it is becoming the operating system of choice for a variety of embedded applications. However, designers of these performance-intensive, embedded SoCs running Linux or other virtual-memory operating systems are challenged with increasing performance requirements within constant or shrinking power budgets. Most processors either achieve the performance g... » read more

The Week In Review: Design

By Ed Sperling - 31 Oct, 2014 - Comments: 0

Tools Mentor Graphics rolled out an extension to its PCB design platform that allows for synchronization of processes across multi-board systems. The new tool captures logic and system definitions for boards, cables, backplanes, cable assemblies, sensors and actuators. Cadence introduced a dynamic characterization solution for mixed signal blocks such as PLLs, data converters, high-speed tr... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: ARC processor

Week in Review: IoT, Security, Auto

Safety in SoCs

Using Multicore Processors To Accelerate Your High-Performance Embedded Linux Applications

The Week In Review: Design