Chiplets Taking Root As Silicon-Proven Hard IP


Chiplets are all the rage today, and for good reason. With the various ways to design a semiconductor-based system today, IP reuse via chiplets appears to be an effective and feasible solution, and a potentially low-cost alternative to shrinking everything to the latest process node. To enable faster time to market, common IP or technology that already has been silicon-proven can be utilized... » read more

Secure Device Updates On Matter


There are many who share the Arm vision of smart connected devices enabling rapid innovation in our work and home in the coming years. Such connectivity promises to yield new applications for solving problems and improving lives. But onlookers are keen to see how the industry resolves a large obstacle to the next phase of digital transformation: how to keep these smart devices securely upd... » read more

Blog Review: Feb. 8


Cadence's Sanjeet Kumar points to key changes and optimizations that are done for USB3 Gen T compared to USB3 Gen X tunneling in order to minimize tunnel overhead and maximize USB3 throughput. Siemens EDA's Harry Foster considers the effectiveness of IC and ASIC verification by looking at schedule overruns, number of required spins, and classification of functional bugs. Synopsys' Chris C... » read more

Project Centauri: Driving Rapid, Exponential IoT Growth With Arm-Based Microcontrollers


Project Centauri is Arm's microcontroller (MCU) platform software initiative, designed to solve common industry problems, reduce barriers to deployment, and enable scale across the Arm Cortex-M ecosystem. Read this white paper to explore: The components and deliverables of Project Centauri How this initiative addresses the needs of the MCU software ecosystem How to get involved wi... » read more

Chip Industry’s Earnings Roundup


Editor's Note: Updated throughout February 2023 for additional earnings releases. Many companies reported revenue growth in the most recent quarter, but the latest round of chip industry earnings releases reflected some major themes: Demand for consumer electronics softened due to inflation, rising interest rates, and post-pandemic market saturation, creating a slump in the memory chip ... » read more

Week in Review: Design, Low Power


Intel discontinued its Pathfinder for RISC-V program, according to numerous reports. The program provided a pre-silicon development environment to support IP selection and early-stage software development using Intel FPGA and simulator platforms. "Since Intel will not be providing any additional releases or bug fixes, we encourage you to promptly transition to third-party RISC-V software tools ... » read more

Solving Problems With The IoT


The Internet of Things, a term once applied to almost any "smart" gadget connected to the Internet, is becoming more useful, more complex, and more of a security risk as the value of data continues to grow and more people depend on IoT technology. In the decades since the concept was first introduced, IoT devices have become so ubiquitous that applications cover practically every consumer, c... » read more

Blog Review: Feb. 1


Siemens EDA's Harry Foster explores trends in low power design techniques for ICs and ASICs, with 72% of design projects reported actively managing power. Synopsys' Charlie Matar, Rita Horner, and Pawini Mahajan look at the concept of reliability, availability, and serviceability (RAS) in the context of high-performance computing SoC designs and how it can be supported with silicon lifecycle... » read more

Improving Performance And Power With HBM3


HBM3 swings open the door to significantly faster data movement between memory and processors, reducing the power it takes to send and receive signals and boosting the performance of systems where high data throughput is required. But using this memory is expensive and complicated, and that likely will continue to be the case in the short term. High Bandwidth Memory 3 (HBM3) is the most rece... » read more

Power Issues Causing More Respins At 7nm And Below


Power consumption has been a major design consideration for some time, but it is far from being a solved issue. In fact, an increasing number of designs have a plethora of power-related problems, and those problems are getting worse in new chip designs. Many designs today are power-limited — or perhaps more accurately stated, thermal-limited. A chip only can consume as much power as it is ... » read more

← Older posts Newer posts →