tag: ARM

New Design Approaches For Automotive
By Ann Mutschler - 01 Jul, 2021 - Comments: 0

The push toward increasing autonomy in automotive is driving new approaches in electronics development. Instead of designing individual components, the focus now is on modeling in context. The ultimate goal is to create an executable specification based on industry-accepted standards, with enough flexibility to be able to customize that spec for different customers. This is a difficult engin... » read more

IoT Security: Confusing And Fragmented
By Bryon Moyer - 01 Jul, 2021 - Comments: 0

Security regulations for Internet-of-Things (IoT) devices are evolving around the world, but there is no consistent set of requirements that can be applied globally — and there may never be. What exists today is a patchwork of certification labs and logos. That makes it difficult for IoT-device designers to know where to get their security blessed. Unlike in data centers, where there is a ... » read more

Blog Review: June 30
By Jesse Allen - 30 Jun, 2021 - Comments: 0

Siemens EDA's Chris Spear considers what classes should represent in SystemVerilog and offers two major categories along with some helpful UVM tips. Cadence's Paul McLellan listens in on keynotes at the recent TSMC Technology Symposium, including TSMC CEO C. C. Wei's introduction some of the fab's new offerings, such as an automotive-focused N5 process. Synopsys' Dennis Kengo Oka notes th... » read more

Data Centers On Wheels
By Ann Mutschler - 28 Jun, 2021 - Comments: 2

Automotive architectures are evolving quickly from domain-based to zonal, leveraging the same kind of high-performance computing now found in data centers to make split-second decisions on the road. This is the third major shift in automotive architectures in the past five years, and it's one that centralizes processing using 7nm and 5nm technology, specialized accelerators, high-speed memor... » read more

Week In Review: Design, Low Power
By Jesse Allen - 25 Jun, 2021 - Comments: 0

Synopsys will acquire the semiconductor and flat panel display solutions of BISTel. The acquisition will add an integrated and comprehensive yield management and prediction solution for manufacturing quality and efficiency. BISTel provides engineering equipment systems and AI applications for smart manufacturing in a range of industries. "Combining Synopsys' and BISTel's expertise in fab soluti... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 25 Jun, 2021 - Comments: 0

Automotive Cadence will be capturing design insights from Presto Engineering, an ASIC designer working on high-performance system-in-package (SiP) development for the automotive and Industrial IoT markets. Presto, which also provides semiconductor services such as test and qualification, will use Cadence’s EDA and analysis tools (Allegro X Package Designer Plus, Clarity 3D Solver, Sigrity Xt... » read more

CEO Outlook: More Data, More Integration, Same Deadlines
By Ed Sperling - 24 Jun, 2021 - Comments: 1

Experts at the Table: Semiconductor Engineering sat down to discuss the future of chip design and EDA tools with Lip-Bu Tan, CEO of Cadence; Simon Segars, CEO of Arm; Joseph Sawicki, executive vice president of Siemens IC EDA; John Kibarian, CEO of PDF Solutions; Prakash Narain, president and CEO of Real Intent; Dean Drako, president and CEO of IC Manage; and Babak Taheri, CEO of Silvaco. What ... » read more

Blog Review: June 23
By Jesse Allen - 23 Jun, 2021 - Comments: 0

Synopsys' Manuel Mota shows how splitting SoCs into smaller dies for advanced packaging and using die-to-die interfaces to enable high bandwidth, low latency, and low power connectivity can benefit hyperscale data centers. Siemens EDA's Chris Spear explains the relationship between classes and objects in SystemVerilog with a handy visualization and notes the difference between SystemVerilog ... » read more

Week In Review: Design, Low Power
By Jesse Allen - 18 Jun, 2021 - Comments: 0

Rambus is making a push for Compute Express Link (CXL) with two acquisitions and the launch of its CXL Memory Interconnect Initiative. The initiative aims to define and develop semiconductor solutions for advanced data center architectures, with initial research and development focusing on solutions to support key memory expansion and pooling use cases. CXL is an open interconnect specificat... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 18 Jun, 2021 - Comments: 0

Automotive U.S. electric truck manufacturer Lordstown Motors has an electric truck but after a large buyer fell through, it admitted it does not have any firm orders on its trucks, according to an AP story. The CEO and CFO resigned earlier this week. The electric car company Canoo announced its US manufacturing facility will be in Oklahoma. Cadence revealed its Tensilica FloatingPoint DSP (... » read more

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