Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 26 Feb, 2021 - Comments: 0

Automotive/Mobility Toyota Motor Corporation developed a hydrogen fuel cell (FC) system packaged in a compact module. Toyota plans to start selling it in the spring of 2021. The module can be used by other companies developing products powered by fuel cells. Micron is sampling an ASIL D level LPDDR5. The low-power memory is qualified for automotive safety applications. Samsung Foundry ce... » read more

Firmware Skills Shortage

By Brian Bailey - 25 Feb, 2021 - Comments: 0

Good hardware without good software is a waste of silicon, but with so many new processors and accelerator architectures being created, and so many new skills required, companies are finding it hard to hire enough engineers with low-level software expertise to satisfy the demand. Writing compilers, mappers and optimization software does not have the same level of pizazz as developing new AI ... » read more

Blog Review: Feb. 24

By Jesse Allen - 24 Feb, 2021 - Comments: 0

Siemens EDA's Harry Foster checks out the efficiency and effectiveness of verification on ASIC and IC designs with a look at how many projects meet the original schedule, the number of required spins, and classification of functional bugs. Cadence's Paul McLellan listens in as Philippe Magarshack of ST Microelectronics on how the company uses massive amounts of data generated by its fabs to ... » read more

Brazil Paves New Semiconductor Path

By Mark LaPedus - 22 Feb, 2021 - Comments: 3

After struggling to get its semiconductor industry off the ground for the last several years, Brazil finally may have found its place in the market with the development of IC design services, memory modules and packaging. Brazil exists well under the radar when it comes to semiconductors. But with little or no fanfare, the nation over the years has been trying to build fabs, assemble chips a... » read more

Breaking The 2nm Barrier

By Mark LaPedus - 18 Feb, 2021 - Comments: 4

Chipmakers continue to make advancements with transistor technologies at the latest process nodes, but the interconnects within these structures are struggling to keep pace. The chip industry is working on several technologies to solve the interconnect bottleneck, but many of those solutions are still in R&D and may not appear for some time — possibly not until 2nm, which is expected t... » read more

FeFETs Bring Promise And Challenges

By Bryon Moyer - 17 Feb, 2021 - Comments: 3

Ferroelectric FETs (FeFETs) and memory (FeRAM) are generating high levels of interest in the research community. Based on a physical mechanism that hasn’t yet been commercially exploited, they join the other interesting new physics ideas that are in various stages of commercialization. “FeRAM is very promising, but it's like all promising memory technologies — it takes a while to get b... » read more

Blog Review: Feb. 17

By Jesse Allen - 17 Feb, 2021 - Comments: 0

In a video, Synopsys' Tim Mackey warns that IoT device manufacturers are dealing with a serious challenge when it comes to security and points to the types of software threats that could impact IoT products. Siemens' Paul van Straten finds that the rise in vehicle complexity and intensified global competition means traditional automotive OEMs will need to explore new approaches to vehicle de... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 12 Feb, 2021 - Comments: 0

Automotive/Mobility With the chip supply so tight it is shutting down automotive production lines, U.S. chip company CEOs signed a Semiconductor Industry Association (SIA) letter asking the U.S. president to include funding incentives for the chip manufacturing in U.S. economic recovery plans. The letter references the CHIPS for America Act and asks the president to work with Congress to suppo... » read more

Usage Models Driving Data Center Architecture Changes

By Ann Mutschler - 11 Feb, 2021 - Comments: 0

Data center architectures are undergoing a significant change, fueled by more data and much greater usage from remote locations. Part of this shift involves the need to move some processing closer to the various memory hierarchies, from SRAM to DRAM to storage. There is more data to process, and it takes less energy and time to process that data in place. But workloads also are being distrib... » read more

Certification And Collaboration Key To Closing IoT Security-Perception Gap

By David Maidment - 11 Feb, 2021 - Comments: 0

When it comes to security today, there’s perception and then there’s cold, hard reality. Here’s the reality: Cybersecurity Ventures expects global cybercrime costs to grow by 15% per year over the next five years, reaching $10.5 trillion annually by 2025, which is triple the 2015 figure. To get a sense for how pervasive the problem is, Symantec set up a “honeypot” system that dete... » read more

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Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: ARM

Week In Review: Auto, Security, Pervasive Computing

Firmware Skills Shortage

Blog Review: Feb. 24

Brazil Paves New Semiconductor Path

Breaking The 2nm Barrier

FeFETs Bring Promise And Challenges

Blog Review: Feb. 17

Week In Review: Auto, Security, Pervasive Computing

Usage Models Driving Data Center Architecture Changes

Certification And Collaboration Key To Closing IoT Security-Perception Gap

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Knowledge Centers
Entities, people and technologies explored