Blog Review: Jan. 22

By Jesse Allen - 22 Jan, 2020 - Comments: 0

Synopsys' Taylor Armerding explains different types of social engineering scams that target everyone from CEOs to gamers to smart appliance users, and what training and tools can better protect people and their organizations. Mentor's Dennis Joseph points to some important things to consider if you're thinking about switching from GDS to OASIS and some tips for converting files. Cadence's... » read more

Non-Volatile Memory Tradeoffs Intensify

By Ann Mutschler - 22 Jan, 2020 - Comments: 0

Non-volatile memory is becoming more complicated at advanced nodes, where price, speed, power and utilization are feeding into some very application-specific tradeoffs about where to place that memory. NVM can be embedded into a chip, or it can be moved off chip with various types of interconnect technology. But that decision is more complicated than it might first appear. It depends on the ... » read more

Priorities Shift In IC Design

By Ann Mutschler - 16 Jan, 2020 - Comments: 0

The rush to the edge and new applications around AI are causing a shift in design strategies toward the highest performance per watt, rather than the highest performance or lowest power. This may sound like hair-splitting, but it has set a scramble in motion around how to process more data more quickly without just relying on faster processors and accelerators. Several factors are driving th... » read more

CES 2020 Highlights New Automotive Tech

By Chet Babla - 16 Jan, 2020 - Comments: 0

Another year, another Consumer Electronics Show (CES) packed with innovative technology. In the many years I’ve been coming to the show, I’ve seen it evolve from a launchpad for the year’s mainstream devices – televisions, laptops, smartphones – to encompass all manner of smart devices within the home and beyond. As the head of automotive at Arm, it’s that ‘beyond’... » read more

Blog Review: Jan. 15

By Jesse Allen - 15 Jan, 2020 - Comments: 0

Cadence's Paul McLellan looks back at the history of lithography, from its fundamental equation to multiple patterning and the challenges facing EUV today. Synopsys' Taylor Armerding warns that medical device security isn't keeping up with new threats, despite positive steps, due in part to lack of funding, delayed initiatives, and a focus on critical service delivery. In a video, Mentor'... » read more

Big Growth Areas: Connectivity, AI, Reliability

By Brian Bailey - 14 Jan, 2020 - Comments: 0

Connectivity and artificial intelligence (AI) will be the biggest drivers for 2020, with an emphasis on improved reliability across all areas. New standards, new applications, and new pressures being placed on old technology will created boundless opportunities for those ready to fill the need. Of course, there will also be a lot of carnage along the way, and we can expect to see a lot of that ... » read more

Week In Review: Design, Low Power

By Jesse Allen - 10 Jan, 2020 - Comments: 0

Synopsys will acquire certain IP assets of INVECAS. The acquisition expands Synopsys' DesignWare Logic Library, General Purpose I/O, Embedded Memory, Interface and Analog IP portfolio. The acquisition will also add a team of experienced R&D engineers to focus on physical IP across a range of process technologies. INVECAS will retain its HDMI IP and ASIC Design Solutions businesses. The deal... » read more

Week In Review: IoT, Security, Autos

By Susan Rambo - 10 Jan, 2020 - Comments: 0

Internet of Things Sensors that see in the dark, look deep into our faces and hear the impossible, were all part of ams’ CES lineup this week. ams announced that it has designed an advanced spectral ambient light sensor (ALS) for high-end mobile phone cameras. The ALS, called the AS7350, identifies the light source and makes an accurate white balance under low-light and other non-ideal condi... » read more

Can Germany’s Auto Industry Keep Pace?

By Jeff Dorsch - 09 Jan, 2020 - Comments: 0

Germany's strength for the past half-century has been its automotive industry. The big question now is whether that also will become its biggest vulnerability. Challenged on all fronts by fundamental shifts in automotive technology, the German auto industry is struggling to transform itself from precision metal bending to advanced electronics, and so far its future in the face of competitors... » read more

Open Source Hardware Risks

By Ann Mutschler - 08 Jan, 2020 - Comments: 0

Open-source hardware is gaining attention on a variety of fronts, from chiplets and the underlying infrastructure to the ecosystems required to support open-source and hybrid open-source and proprietary designs. Open-source development is hardly a new topic. It has proven to be a successful strategy in the Linux world, but far less so on the hardware side. That is beginning to change, fueled... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?