tag: ARM

Making Sense Of ML Metrics
By Ed Sperling - 16 Oct, 2019 - Comments: 0

Steve Roddy, vice president of products for Arm’s Machine Learning Group, talks with Semiconductor Engineering about what different metrics actually mean, and why they can vary by individual applications and use cases. » read more

Blog Review: Oct. 16
By Jesse Allen - 16 Oct, 2019 - Comments: 0

Arm's Greg Yeric dives into the challenges facing the semiconductor industry and potential solutions that could possibly have huge impacts toward the year 2030, from DNA self-assembly to new physics, in an adaptation of his wide-ranging Arm TechCon keynote. Cadence's Paul McLellan considers Google's recent quantum computing achievement, what quantum supremacy really means, and where it leave... » read more

Week In Review: Design, Low Power
By Jesse Allen - 11 Oct, 2019 - Comments: 0

M&A Dialog Semiconductor will acquire Creative Chips for approximately $80 million cash, with contingent consideration of up to $23 million. The move will expand Dialog's Industrial IoT portfolio, adding Creative Chips' industrial Ethernet and other mixed-signal products for connecting large numbers of IIoT sensors to industrial networks. Based in Bingen, Germany, Creative Chips was founded in... » read more

Week in Review – IoT, Security, Autos
By Jeff Dorsch - 11 Oct, 2019 - Comments: 0

Products/Services Arm TechCon got under way with a series of announcements. Arm is a founding member of the Autonomous Vehicle Computing Consortium, along with General Motors, Toyota Motor, DENSO, Continental, Bosch, NXP Semiconductors, and Nvidia. More information on the consortium is available here. “Imagine a world where vehicles are able to perceive their dynamically changing environment... » read more

Less Margin, More Respins, And New Markets
By Ed Sperling - 10 Oct, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss the impact of multi-physics and new market applications on chip design with John Lee, general manager and vice president of ANSYS' Semiconductor Business Unit; Simon Burke, distinguished engineer at Xilinx; Duane Boning, professor of electrical engineering and computer science at MIT; and Thomas Harms, director EDA/IP Alliance at Infineon. What foll... » read more

AI Warnings For Safer Driving
By Kazuki Ohta - 10 Oct, 2019 - Comments: 0

You’re driving to work, the same route you take every day. But this time, a storm passes over: you’re suddenly faced with heavy rain and reduced visibility. All of a sudden, the “accident score” meter on your car’s dashboard moves into the red. You ease off the gas, move out of the passing lane and your score drops down to amber—you can’t get it into the green due to the advers... » read more

Blog Review: Oct. 9
By Jesse Allen - 09 Oct, 2019 - Comments: 0

In a video, Cadence's Tom Hackett continues his introduction to finite element analysis (FEA) and the important role it can play in electronics deign. Mentor's Colin Walls considers dynamic memory allocation in real-time operating systems and the problems of non-deterministic behavior and ill-defined failure modes. Synopsys' Taylor Armerding contends that ethical hackers are a necessary p... » read more

Armv8.5-A Memory Tagging Extension
By Arm - 09 Oct, 2019 - Comments: 0

The Internet worm of 1988 took offline one tenth of the fledgling network, and severely slowed down the remainder [1]. Over 30 years later, two of the most important classes of security vulnerability in code written in C-like languages are still violations of memory safety. According to a 2019 BlueHat presentation, 70% of all security issues addressed in Microsoft products are caused by violati... » read more

More Data, More Processing, More Chips
By Ed Sperling - 07 Oct, 2019 - Comments: 0

Simon Segars, CEO of Arm, sat down with Semiconductor Engineering to talk about the impact of heterogeneous computing and new packaging approaches on IP, the need for more security, and how 5G and the edge will impact compute architectures and the chip industry. SE: There are a whole bunch of new markets opening up. How does Arm plan to tackle those? Segars: Luckily for us, we can design ... » read more

Week in Review – IoT, Security, Autos
By Jeff Dorsch - 04 Oct, 2019 - Comments: 0

Products/Services Cadence Design Systems is working with Adesto Technologies to grow the Expanded Serial Peripheral Interface (xSPI) communication protocol ecosystem, for use in Internet of Things devices. The Cadence Memory Model for xSPI allows customers to ensure optimal use of the octal NOR flash with the host processor in an xSPI system, including support for Adesto’s EcoXiP octal xSPI ... » read more

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