The Week In Review: Manufacturing

By Mark LaPedus - 05 Jan, 2018 - Comments: 0

Chipmakers Semiconductor IP startup eVaderis has demonstrated a design platform through an ultra-low-power microcontroller (MCU) in Beyond Semiconductor’s BA2X product line. The software, system and memory IP developed by eVaderis make Beyond Semiconductor’s new MCU ideally suited for battery-powered applications in IoT and wearable electronics. By incorporating the latest STT-MRAM tec... » read more

The Week In Review: Design

By Jesse Allen - 23 Dec, 2016 - Comments: 0

M&A ARM reached further into the HPC space with its acquisition of Allinea Software, a provider of debug and performance analysis tools for HPC systems. Currently, 80% of the world's top 25 supercomputers use Allinea's tools, and ARM will continue supporting multiple processor architectures. Terms of the deal were not disclosed. PLDA Group is spinning out its QuickPlay C/C++ tool for ... » read more

The Week In Review: IoT

By Jeff Dorsch - 16 Sep, 2016 - Comments: 0

Deals Verizon Communications agreed to acquire Sensity Systems of Sunnyvale, Calif., a supplier of energy-efficient light-emitting diode lighting equipment to serve as the foundation for its Internet of Things platform for smart cities; financial terms weren’t disclosed. The transaction is expected to close in the fourth quarter. Mike Lanman, Verizon’s senior vice president of Enterprise P... » read more

The Week In Review: Design/IoT

By Jesse Allen - 15 Jan, 2016 - Comments: 0

Tools Rambus' Cryptography Research Division uncorked a new security platform for protecting and sharing 4K UHD and high dynamic range programming. It allows consumers to store, copy and share digital content across multiple devices, while also protecting the content from theft. Included are a secure core, a software player, and trusted key provisioning. Deals Arrow and Cadence announc... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Arrow

The Week In Review: Manufacturing

The Week In Review: Design

The Week In Review: IoT

The Week In Review: Design/IoT