The Week In Review: Design/IoT

Rambus rolls out package to secure and share 4K content; Arrow and Cadence team up; deals for Arteris and Sonics; Cadence benchmark; DVCon schedule; art at DAC.



Rambus‘ Cryptography Research Division uncorked a new security platform for protecting and sharing 4K UHD and high dynamic range programming. It allows consumers to store, copy and share digital content across multiple devices, while also protecting the content from theft. Included are a secure core, a software player, and trusted key provisioning.


Arrow and Cadence announced a collaboration which would allow engineers using Cadence’s OrCAD PCB design tools to access Arrow’s online component and reference design data available through SiliconExpert.

Arteris won a deal with Renesas, which will be using FlexNoC Physical IP in its High-End SoC business division.

Sonics signed the first customer for its hardware-based power management and control technology introduced last year. According to Sonics, the company will integrate it into a high-volume mobile application.

Cadence says its customers have completed more than 200 tapeouts using Tempus Timing Signoff Solution, introduced in the fall of 2013.


If you’re headed to DVCon in San Jose (Feb. 29 – Mar. 3), the schedule is now available for perusal. (Plus, SemiEngineering’s Brian Bailey has a panel inspired by the article, What ESL Is Really About.)

This year’s DAC will have something a bit different to offer: an art show to showcase the beauty and creativity of electronic systems and component design. If you have a digital image related to EDA and semiconductors worthy of framing and display, the submission deadline is March 24.

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