In Case You Missed It

By Mike Gianfagna - 25 Jan, 2018 - Comments: 0

We recently held two very successful seminars in Tokyo and Shanghai. Samsung Memory presented their HBM2 solutions, Samsung Foundry talked about their advanced 14nm FinFET solutions, ASE Group reviewed their advanced 2.5D packaging solutions, eSilicon presented our ASIC and 2.5D design/implementation and IP solutions, Rambus detailed their high-performance SerDes solutions and Northwest Logic p... » read more

The Future Of AI Is In Materials

By Sundeep Bajikar - 09 Jan, 2018 - Comments: 0

I had the pleasure of hosting an eye-opening presentation and Q&A with Dr. Jeff Welser of IBM at a recent Applied Materials technical event in San Francisco. Dr. Welser is Vice President and Director of IBM Research's Almaden lab in San Jose. He made the case that the future of hardware is AI. At Applied Materials we believe that advanced materials engineering holds the keys to unlocking... » read more

Preparing For Bigger Changes Ahead

By Ed Sperling - 21 Dec, 2017 - Comments: 0

The semiconductor industry has undergone a fundamental shift over the past year, and it's one that will redefine chipmaking over the next decade or more. While the focus is still on building the fastest, lowest-power devices, whether that's by shrinking features or packaging them into blazing-fast 2.5D or fan-out configurations, these devices are being customized for specific use cases much ... » read more

What’s Next?

By Mike Gianfagna - 21 Dec, 2017 - Comments: 0

We just concluded two very successful seminars in Tokyo and Shanghai. Samsung Memory presented their HBM2 solutions, Samsung Foundry talked about their advanced 14nm FinFET solutions, ASE Group reviewed their advanced 2.5D packaging solutions, eSilicon presented our ASIC and 2.5D design/implementation and IP solutions, Rambus detailed their high-performance SerDes solutions and Northwest Logic ... » read more

Lowering The Barriers To Entry For ASICs

By Arm - 29 Nov, 2017 - Comments: 0

The future of IoT and its rate of scalability depends upon increased functionality in the smallest form factors. Arm knows that OEMs are increasingly turning to custom SoCs/ASICs for a wealth of benefits: differentiation, cost savings, improved reliability, and smaller products. So, at Arm, we wanted to better understand the perceived risks involved for OEMs – what makes custom SoCs a task... » read more

Automotive Foundries

By Ed Sperling - 16 Nov, 2017 - Comments: 0

The race to win a piece of the automotive electronics business has now reached the foundry level, and right now it's not clear exactly how this is going to work. This is uncharted territory for everyone. The build-out of electronics for assisted and autonomous driving is brand new. For existing cars, most of the chips being used are off-the-shelf microcontrollers, commodity MEMS sensors, and... » read more

Where MEMS Can Boldly Go Now

By Jeff Dorsch - 06 Nov, 2017 - Comments: 1

MEMS chips are being designed to go into the human body as biosensors, which will require unique packaging. And as demand grows for assisted and automated driving, MEMS devices also are finding new use cases in automotive electronics, their chief market segment prior to the millennium. Pressure sensors, such as those that monitor the air pressure in tires, remain the biggest type of [getkc i... » read more

eFPGA Acceleration in SoCs

By Achronix - 01 Nov, 2017 - Comments: 0

The Speedcore design and integration methodology has been defined with intimate awareness of the difficulties ASIC engineering teams must contend with. All the necessary files and flows for capturing the functional, timing and power characteristics of a user-defined and programmed Speedcore instance, along with support for successfully reconfiguring an already field-deployed Speedcore IP embedd... » read more

Targeting And Tailoring eFPGAs

By Ed Sperling - 17 Oct, 2017 - Comments: 0

Robert Blake, president and CEO of Achronix, sat down with Semiconductor Engineering to discuss what's changing in the embedded FPGA world, why new levels of customization are so important, and difficulty levels for implementing embedded programmability. What follows are excerpts of that discussion. SE: There are numerous ways you can go about creating a chip these days, but many of the prot... » read more

A Chip For All Seasons

By Jeff Dorsch - 07 Sep, 2017 - Comments: 0

FPGAs are showing up in more designs and in more markets, and as they get included in more systems they are becoming much more complex. A decade ago, the key markets for [gettech id="31071" t_name="FPGAs"] were industrial, medical, automotive and aerospace. Those markets remain strong, but FPGAs also are playing a role in artificial intelligence, data centers, the [getkc id="76" kc_name="... » read more

← Older posts Newer posts →

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: ASICs

In Case You Missed It

The Future Of AI Is In Materials

Preparing For Bigger Changes Ahead

What’s Next?

Lowering The Barriers To Entry For ASICs

Automotive Foundries

Where MEMS Can Boldly Go Now

eFPGA Acceleration in SoCs

Targeting And Tailoring eFPGAs

A Chip For All Seasons

Trending Articles

Hybrid Bonding Makes Strides Toward Manufacturability

Americas Chip Funding Energizes Industry

Advanced Packaging Driving New Collaboration Across Supply Chain

Chiplets Make Progress Using Interconnects As Glue

2D Semiconductors Make Progress, But So Does Silicon

Knowledge Centers
Entities, people and technologies explored