Portable Stimulus And Digital Twins

By Brian Bailey - 25 Nov, 2019 - Comments: 0

It has been a year since Accellera's Portable Test and Stimulus Specification became a standard. Semiconductor Engineering sat down to discuss the impact it has had, and the future direction of it, with Larry Melling, product management director for Cadence; Tom Fitzpatrick, strategic verification architect for Mentor, a Siemens Business; Tom Anderson, technical marketing consultant for OneSp... » read more

Chip Security Needs A New Language

By Sven Beyer - 26 Aug, 2019 - Comments: 0

By Sven Beyer and Sergio Marchese Safety- and security-critical systems, such as connected autonomous vehicles, require high-integrity integrated circuits (ICs). Functional correctness and safety are necessary to establish IC integrity, but not sufficient. Security is another critical pillar of IC integrity. Systems and products using ICs with security vulnerabilities ultimately undermine th... » read more

A Holistic View Of RISC-V Verification

By Nicolae Tusinschi - 07 Aug, 2019 - Comments: 0

Last month, we discussed the growth of the RISC-V open processor ecosystem, the two main organizations driving it, and the role that OneSpin plays. In addition, we have become very active in the RISC-V community and have more than a dozen technical articles published, conference talks presented, and upcoming talks accepted. We tend to focus on the challenges of verifying RISC-V IP cores and sys... » read more

How To Optimize Verification

By Brian Bailey - 25 Jul, 2019 - Comments: 0

The rate of improvement in verification tools and methodologies has been nothing short of staggering, but that has created new kinds of problems for verification teams. Over the past 20 years, verification has transformed from a single language (Verilog) and tool (simulator) to utilizing many languages (testbench languages, assertion languages, coverage languages, constraint languages), many... » read more

Shift-Left Low Power Verification With UPF Information Model

By Himanshu Bhatt - 30 May, 2019 - Comments: 0

By Himanshu Bhatt, Shreedhar Ramachandra and Narayanan Ganesan Low power testbenches today have no visibility of the UPF objects and their states during a low power simulation. This has been one of the factors limiting the users from writing re-usable low power testbenches that can monitor the UPF objects and react to the state changes of UPF objects. To meet this requirement for the user to... » read more

Mitigating Risk Through Verification

By Ann Mutschler - 05 Dec, 2018 - Comments: 0

Verification is all about mitigating risk, and one of the growing issues alongside of increasing complexity and new architectures is coverage. The whole notion of coverage is making sure a chip will work as designed. That requires determining the effectiveness of the simulation tests that stimulate it, and its effectiveness in terms of activating structures of functional behavior and design.... » read more

Formal Signoff

By Ed Sperling - 04 Dec, 2018 - Comments: 0

Xiaolin Chen, senior AE at Synopsys, looks at what’s good enough coverage, what makes one assertion better than another, and where the potential holes are in verification. https://youtu.be/nBtKE0gDHBU » read more

Verification As A Flow (Part 1)

By Brian Bailey - 05 Jul, 2018 - Comments: 2

Semiconductor Engineering sat down to discuss the transformation of verification from a tool to a flow with Vladislav Palfy, global manager application engineering for OneSpin Solutions; Dave Kelf, chief marketing officer for Breker Verification Systems; Mark Olen, product marketing group manager for Mentor, A Siemens Business; Larry Melling, product management director, System & Verificati... » read more

Formal Abstraction And Coverage

By Brian Bailey - 28 Jun, 2018 - Comments: 0

For the past three years, Oski Technology has facilitated a gathering of formal verification experts over dinner to discuss the problems and issues that they face. They discuss techniques they have been attempting with formal verification technologies, along with the results they have been achieving. Semiconductor Engineering was there to record that conversation and to condense it into the ... » read more

Tech Talk: FPGA RTL Checking

By Ed Sperling - 26 Apr, 2018 - Comments: 3

Tobias Welp, software architect and engineering manager at OneSpin Solutions, explains how to ensure the RTL created by design engineers matches what shows up in an FPGA. https://youtu.be/0N1PDYyq0dY » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?