tag: A*Star

Chip Industry Week In Review
By The SE Staff - 15 Nov, 2024 - Comments: 0

CSIS issued a new report that says Intel is "not too big to fail, but too good to lose." The report noted that Intel is needed for national security, and that it must be viewed in a geopolitical context rather than from a purely business standpoint when it comes to funding the company. Japan's government is creating a 10 trillion yen (~$65 billion) fund for next-gen technologies, including A... » read more

High-Temperature Processing of Molybdenum Interconnects
By Technical Paper Link - 11 Nov, 2024 - Comments: 0

A technical paper titled "Solving the Annealing of Mo Interconnects for Next-Gen Integrated Circuits" was published by researchers at the National University of Singapore, A*STAR, and imec. Abstract "Recent surge in demand for computational power combined with strict constraints on energy consumption requires persistent increase in the density of transistors and memory cells in integrated ... » read more

Research Bits: March 26
By Jesse Allen - 26 Mar, 2024 - Comments: 0

Skyrmion switches Researchers from the Agency for Science, Technology and Research (A*STAR) and National University of Singapore harnessed skyrmions to build a switch that has the potential to process data faster while using significantly less energy. Skyrmions are magnetic whirls that form in very thin metal layers and can be efficiently moved between magnetic regions. Using a magnetic tun... » read more

Chip Industry’s Technical Paper Roundup: Oct 25
By Linda Christensen - 25 Oct, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=59 /] » read more

Active Learning to Reduce Data Requirements For Defect Identification in Semiconductor Manufacturing
By Technical Paper Link - 24 Oct, 2022 - Comments: 0

A new technical paper titled "Exploring Active Learning for Semiconductor Defect Segmentation" was published by researchers at Agency for Science, Technology and Research (A*STAR) in Singapore. "We identify two unique challenges when applying AL on semiconductor XRM scans: large domain shift and severe class-imbalance. To address these challenges, we propose to perform contrastive pretrainin... » read more

Technical Paper Roundup: Sept 27
By Linda Christensen - 27 Sep, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=53 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit f... » read more

Implementations of 2D Material-Based Devices For IoT Security
By Technical Paper Link - 14 Sep, 2022 - Comments: 0

A new research paper titled "Application of 2D Materials in Hardware Security for Internet-of-Things: Progress and Perspective" was published by researchers at National University of Singapore and A*STAR. The paper explores the "implementation of hardware security using 2D materials, for example, true random number generators (TRNGs), physical unclonable functions (PUFs), camouflage, and ant... » read more

Week In Review: Design, Low Power
By Jesse Allen - 14 Jan, 2022 - Comments: 0

Nvidia again made its case for acquiring Arm to the UK's Competition and Markets Authority (CMA). “Arm is a private for-profit business at a crossroads. After acquiring Arm several years ago, SoftBank increased Arm’s headcount, hoping to spur long-term growth in several markets, including data center and personal computer, long dominated by Intel and x86. SoftBank’s investment phase has c... » read more

Manufacturing Bits: July 13
By Mark LaPedus - 13 Jul, 2021 - Comments: 0

Heterogenous III-V packaging At the recent 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), a group presented a paper on the development of a wafer-level fan-out package using heterogenous III-V devices. This paper deals with the packaging of two III-V chips for use in RF transceiver applications in base stations. III-V Lab, CEA-Leti, Thales and United Monolithic Semic... » read more

Bumps Vs. Hybrid Bonding For Advanced Packaging
By Mark LaPedus - 23 Jun, 2021 - Comments: 3

Advanced packaging continues to gain steam, but now customers must decide whether to design their next high-end packages using existing interconnect schemes or move to a next-generation, higher-density technology called copper hybrid bonding. The decision is far from simple, and in some cases both technologies may be used. Each technology adds new capabilities in next-generation advanced pac... » read more

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