The Week In Review: Manufacturing

Fab tools Samsung Electronics has broken ground on a new extreme ultraviolet (EUV) lithography facility in Hwaseong, South Korea. The new EUV facility is expected to be completed within the second half of 2019 with production slated for 2020. The initial investment in the new EUV line is projected to reach $6 billion by 2020. Imec and Cadence Design Systems have collaborated on the develop... » read more

Cheaper Packaging Options Ahead

Lower-cost packaging options and interconnects are either under development or just being commercialized, all of which could have a significant impact on the economics of advanced packaging. By far, the most cited reason why companies don't adopt advanced [getkc id="27" kc_name="packaging"] is cost. Currently, silicon [getkc id="204" kc_name="interposers"] add about $30 to the price of a med... » read more

The Week In Review: Manufacturing

Chipmakers Intel and Micron have ended their long-running NAND joint development partnership. The companies will continue to develop NAND, but they will work independently on future generations of 3D NAND. The companies have agreed to complete the development of their third-generation of 3D NAND technology, which will be delivered towards the end of 2018. That is expected to be a 96-layer ... » read more

2017: A Good Year for ATE

The rising revenue enjoyed by automatic test equipment vendors in 2017 translated into soaring stock prices for some publicly held companies. The Dow Jones Industrial Average was up 25% for 2017. Advantest’s shares traded on the Tokyo Stock Exchange had a 2017 low of 1,787 yen (about $15.85 at the year-end currency exchange rate) and a 52-week high of 2,698 yen ($23.92), up 51% from the... » read more

Auto Chip Test Issues Grow

By Jeff Dorsch & Ed Sperling Semiconductor suppliers are flocking to the automotive chip market to gain share in fitting out the connected car and the autonomous vehicle. But before those chips are sold to automotive manufacturers and Tier 1 suppliers, they must be tested and certified to meet stringent industry standards. This is no ordinary testing, though. Assisted and autonomous v... » read more

Getting Serious About Chiplets

Demand for increasingly complex computation, more features, lower power, and shorter lifecycles are prompting chipmakers to examine how standardized hard IP can be used to quickly assemble systems for specific applications. The idea of using chiplets, with or without a package, has been circulating for at least a half-dozen years, and they can trace their origin back to IBM's packaging schem... » read more

The Week In Review: Manufacturing

Chipmakers Semiconductor IP startup eVaderis has demonstrated a design platform through an ultra-low-power microcontroller (MCU) in Beyond Semiconductor’s BA2X product line. The software, system and memory IP developed by eVaderis make Beyond Semiconductor’s new MCU ideally suited for battery-powered applications in IoT and wearable electronics. By incorporating the latest STT-MRAM tec... » read more

The Week In Review: Manufacturing

Chipmakers, LCD suppliers United Microelectronics Corp. (UMC) has announced the availability of the company’s 40nm process platform that incorporates Silicon Storage Technology’s (SST) embedded SuperFlash non-volatile memory. The 40nm SST process features a >20% reduction in eFlash cell size and 20-30% macro area over UMC’s 55nm SST technology. Toshiba Electronic Devices & Storage has s... » read more

Changes Ahead For Test

Testing microprocessors is becoming more difficult and more time consuming as these devices are designed to take on more complex tasks, such as accelerating artificial intelligence computing, enabling automated driving, and supporting deep neural networks. This is not just limited to microprocessors, either. Graphics processing units are grabbing market share in supercomputing and other area... » read more

That Was The Year That Was In Test

Looking back on the year about to end, one deal stands out, because it is in legal limbo – the proposed $580 million acquisition of Xcerra by Hubei Xinyan Equity Investment Partnership. At this writing, the transaction has not been completed. Both parties said they planned to sew up the purchase by the end of 2017, so a few weeks remain to make that happen. The deal is in the hands of t... » read more

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