Week In Review: Manufacturing, Test


Test There is more consolidation in the ATE business. In October, Cohu completed the acquisition of Xcerra, a supplier of ATE and other products. Then, Astronics this week entered into an agreement for the sale of the intellectual-property and certain assets associated with its semiconductor test business to Advantest for $185 million in cash. The sale additionally includes a $30 million earn-... » read more

Week In Review: Manufacturing, Test


Trade SEMI has voiced support and encouragement for trade discussions between U.S. President Donald Trump and the People's Republic of China President Xi Jinping. The talks are planned for Dec. 1 during the G20 Summit in Argentina. SEMI expressed hope for a deal and offered principles beneficial to the microelectronics supply chain. Recent tariffs and trade tensions, on top of rumored expor... » read more

System-Level Testing – The New Paradigm for Semiconductor Quality Control


Covering the history and trends of system-level test for semiconductors, this solution brief discusses: The increasing complexities of testing advanced semiconductor integrated devices across a span of applications: automotive, mobile computing, wearables, and more; Semiconductor trends driving necessary shifts in testing methodologies including SiP, SoC, 3D finFETs, heterogeneous compo... » read more

Testing Millimeter Wave for 5G


By Susan Rambo and Ed Sperling The telecommunications world is hurtling toward 5G, but there is no consistency about how this next-gen wireless technology will be rolled out across various regions and plenty of unknowns about how it will be tested and how reliable it will be initially. A fair amount of confusion exists around what 5G constitutes in the first place. There is sub-6GHz 5G, w... » read more

Lab-To-Fab Testing


Test equipment vendors are working on integrating testing and simulation in the lab with testing done later in the fab, setting the stage for what potentially could be the most significant change in semiconductor test in years. If they are successful, this could greatly simplify design for test, which has become increasingly difficult as chips get more complex, denser, and as more heterogene... » read more

Automakers Take On More Responsibility


Chip and EDA companies are scrambling to deal with stiff safety regulations and harsh environmental conditions for automotive chips, but automakers are making big changes of their own to ensure all those components work together as expected. The result is a significant shift of responsibilities of companies in the automotive supply chain. Carmakers traditionally have left verification, valid... » read more

Week In Review: Manufacturing, Test


Chipmakers Fujitsu, once a major manufacturer of ICs, continues to move away from chip production. On Semiconductor has completed the incremental 20% share purchase of Aizu Fujitsu Semiconductor Manufacturing, Fujitsu’s 200mm wafer fab in Aizu-Wakamatsu. On Semi will now hold a 60% majority ownership in the fab joint venture. Consequently, the name of the venture will transition to On Semico... » read more

Week In Review: Manufacturing, Test


Tariffs The Office of the U.S. Trade Representative (USTR) has released a list of $200 billion worth of Chinese imports that will be subject to tariffs. These actions are on top of another set of tariffs, which were put in place. The additional tariffs will be effective starting Sept. 24, and initially will be in the amount of 10%. Starting Jan. 1, 2019, the level of the additional tariffs wi... » read more

System-Level Test: Where Does It Fit?


Our second C-Brief discusses where system-level test (SLT) best fits into your semiconductor test workflow. With automated testing equipment (ATE), a traditional workflow may consist of: Wafer sort (WS) Burn-in after packaging (BI) Combination of structural testing (ST) and functional testing (FT). As demands on high-volume manufacturing shift in response to wider industry and com... » read more

The Race To Zero Defects


By Jeff Dorsch and Ed Sperling Testing chips is becoming more difficult, more time-consuming, and much more critical—particularly as these chips end up in cars, industrial automation, and a variety of edge devices. Now the question is how to provide enough test coverage to ensure that chips will work as expected without slowing down the manufacturing process or driving up costs. Balanci... » read more

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