tag: Astronics

Variation Spreads At 10/7nm
By Ed Sperling - 16 Nov, 2017 - Comments: 6

Variation between different manufacturing equipment is becoming increasingly troublesome as chipmakers push to 10/7nm and beyond. Process variation is a well-known phenomenon at advanced nodes. But some of that is actually due to variations in equipment—sometimes the exact same model from the same vendor. Normally this would fall well below the radar of the semiconductor industry. But as t... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 10 Nov, 2017 - Comments: 0

Packaging and test A*STAR’s Institute of Microelectronics (IME) has formed a fan-out wafer-level packaging consortium comprising of OSATs, materials vendors, equipment suppliers and others. The group is called the FOWLP Development Line Consortium. As part of the announcement, Singapore’s IME has established a development line to accelerate the development of fan-out. Located in IME’s... » read more

2017 ITC Wrap-up
By Jeff Dorsch - 06 Nov, 2017 - Comments: 0

Advantest was among the exhibitors and corporate sponsors at last week’s 2017 International Test Conference in Fort Worth, Texas. The automatic test equipment company also presented papers, took part in sessions, and provided posters during ITC’s technical program. In the booth, Advantest demonstrated its on-demand CloudTesting Service. It also showed off its EVA100 analog/mixed-signal IC t... » read more

Chiplets Gaining Steam
By Ann Mutschler - 06 Nov, 2017 - Comments: 0

Building chips from pre-verified chiplets is beginning to gain traction as a way of cutting costs and reducing time to market for heterogeneous designs. The chiplet concept has been on the drawing board for some time, but it has been viewed more as a possible future direction than a necessary solution. That perception is beginning to change as complexity rises, particularly at advanced nodes... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 03 Nov, 2017 - Comments: 0

Chipmakers Bloomberg has reported that Broadcom is in talks to acquire Qualcomm for $70 per share or about $90 billion. Qualcomm is attempting to acquire NXP, but Broadcom has its sights on Qualcomm, not NXP. “We think AVGO would want to acquire QCOM assets not NXP,” said Amit Daryanani, an analyst with RBC. Samsung continues to reshuffle its management amid a plethora of changes at t... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 27 Oct, 2017 - Comments: 0

Chipmakers At this week’s International Wafer-Level Packaging Conference (IWLPC), Samsung disclosed details about its efforts in the panel-level fan-out market. Samsung as well as ASE, Nepes and others are developing a next-generation fan-out technology using a panel-level format. In panel-level fan-out packaging, you can put more die on a panel as compared to a traditional round wafer, w... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 13 Oct, 2017 - Comments: 0

Materials and equipment A scandal has rocked Japan’s Kobe Steel. The company disclosed that it has falsified inspection data for iron powder, aluminum and copper products that were sent to over 200 customers in the automotive, electronics, transportation and other sectors. The falsified data involves 20,000 tones of products, according to reports. Kobe apologized for the issues and provided ... » read more

Improving Yield, Reliability With Data
By Ann Mutschler - 11 Oct, 2017 - Comments: 0

Big data techniques for sorting through massive amounts of data to identify aberrations are beginning to find a home in semiconductor manufacturing, fueled by new requirements in safety-critical markets such as automotive as well as the rising price of packaged chips in smartphones. Outlier detection—the process of finding data points outside the normal distribution—isn't a new idea. It ... » read more

The 2017 International Test Conference
By Jeff Dorsch - 09 Oct, 2017 - Comments: 0

Machine learning is a hot topic at many technical conferences this year. It will be true at the upcoming International Test Conference, which opens near the end of this month in Fort Worth, Texas. On Sunday, October 29, there are two tutorials devoted to machine learning. Monday, October 30, will have one tutorial related to the topic. The conference gets fully under way on Halloween, wit... » read more

Toward System-Level Test
By Ed Sperling - 09 Oct, 2017 - Comments: 0

The push toward more complex integration in chips, advanced packaging, and the use of those chips for new applications is turning the test world upside down. Most people think of test as a single operation that is performed during manufacturing. In reality it is a portfolio of separate operations, and the number of tests required is growing as designs become more heterogeneous and as they ar... » read more

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