tag: ATE

Delivering On Power During HPC Test
By Anne Meixner - 09 Jul, 2024 - Comments: 0

The industry’s insatiable need for power in high-performance computing (HPC) is creating problems for test cells, which need to deliver very high currents at very consistent voltage levels through the power delivery network (PDN). In response, ATE, wafer probe, and contactor vendors are introducing some innovative approaches and test procedures that can ensure robust power delivery to ATE pro... » read more

Automotive Semiconductors Require Integrated Test Solution
By Toni Dircherl - 09 Jul, 2024 - Comments: 0

The automotive semiconductor test market is experiencing organic growth as chipmakers produce higher volumes of devices serving an array of automotive applications. In addition, the range of applications for automotive-grade semiconductors is evolving as the technology advances. Manufacturers of automated test equipment (ATE) are adapting to ensure their systems can handle devices ranging from ... » read more

What’s Missing In Test
By Anne Meixner - 19 Jun, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss how functional test content is brought up at first silicon, and the balance between ATE and system-level testing, with Klaus-Dieter Hilliges, V93000 platform extension manager at Advantest Europe; Robert Cavagnaro, fellow in the Design Engineering Group at Intel (responsible for manufacturing and test strategy of data center... » read more

Supporting Multiple Time Domains In SoC Production Test
By Hari Mani - 14 May, 2024 - Comments: 0

Complex system-on-chip (SoC) devices make every stage of the development flow harder, and the challenges continue even after the silicon is fabricated. Automatic test equipment (ATE) screening for defective wafers and assembled chips is always challenging. Production test engineers constantly struggle to minimize expensive test pattern memory, test each wafer or chip as quickly as possible, and... » read more

The Future Of Fault Coverage In Chips
By Gregory Haley - 14 May, 2024 - Comments: 0

Heterogeneous integration and sophisticated packaging are making chips more difficult to test, necessitating more versatile and efficient testing methods to minimize the time and cost it takes for each test insertion. In the past, test costs typically were limited to about 2% of the total cost of a chip. That cost has been rising in recent years, and with chiplets, advanced packaging, and mo... » read more

Battery Management Testing: Alleviating EV Buyer Anxiety
By Thomas Koehler - 14 May, 2024 - Comments: 0

As the electric vehicle (EV) market surges towards 2040, fueled by strong consumer enthusiasm, the need to address key concerns about EV range, reliability, and battery life has become critical. Anxiety over potential range limitations, amplified by fears of scarce charging options, alongside safety worries due to media-reported battery incidents, have slowed adoption rates. Here, the semicondu... » read more

Improvement of High-Gradation DDIC Device Test Yield By T6391 High-Accuracy Measurement Solution
By Advantest - 14 May, 2024 - Comments: 0

For DDIC (Display Driver IC) for OLED (Organic Light Emitting Diode) displays for smartphones and IT displays (tablets, laptops) and head mounted displays for AR (Augmented Reality)/VR (Virtual Reality), the output voltage will be divided into more highly-defined steps than in the past. A new per-pin digitizer and comparator module “LCD HP” was developed to measure the output voltage of the... » read more

IC Test And Quality Requirements Drive New Collaboration
By Laura Peters - 09 Apr, 2024 - Comments: 0

Rapidly increasing chip and package complexity, coupled with an incessant demand for more reliability, has triggered a frenzy of alliances and working relationships that are starting to redefine how chips are tested and monitored. At the core of this shift is a growing recognition that no company can do everything, and that to work together will require much tighter integration of flows, met... » read more

Using Deep Data For Improved Reliability Testing
By Ed Sperling - 08 Jan, 2024 - Comments: 0

Reliability testing always has been a challenge for semiconductor companies, but it’s becoming much more difficult as devices continue to shrink, as they’re integrated together in advanced packages, and as they’re utilized under different conditions with life expectancy that varies by application and use case. Nir Sever, senior director of business development at proteanTecs, and Luca Mor... » read more

Testing ICs Faster, Sooner, And Better
By Laura Peters - 12 Dec, 2023 - Comments: 0

The infrastructure around semiconductor testing is changing as companies build systems capable of managing big data, utilizing real-time data streams and analysis to reduce escape rates on complex IC devices. At the heart of these tooling and operational changes is the need to solve infant mortality issues faster, and to catch latent failures before they become reliability problems in the fi... » read more

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