By Mark LaPedus
Over the years, suppliers of metrology equipment have managed to meet the requirements for conventional planar chips. But tool vendors now find themselves behind in the emerging 3D chip era, prompting the urgent need for a new class of 3D metrology gear.
3D is a catch-all phrase that includes a range of new architectures, such as finFET transistors, 3D NAND and stacked-die ...
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