Blog Review: May 14

By Ed Sperling - 14 May, 2014 - Comments: 0

Ansys’ Bill Vandermark highlights the top five engineering articles of the week. Of particular note is element No. 117, a new entry in the periodic table. The temporary name is ununseptium, which means…well, surprise…117. Cadence’s Brian Fuller follows a panel discussion about the biggest potential roadblock for the IoT’s success—privacy and security. You’ve been warned. Syn... » read more

Pointing Fingers, Often In The Wrong Direction

By Ed Sperling - 08 May, 2014 - Comments: 0

Every design these days, regardless of whether it’s a processor, an SoC, an ASIC, FPGA or stacked die, relies on a combination of re-used and third-party intellectual property. No company—not even Intel, Apple or Samsung—has the capability of building everything itself within a highly compressed market window. There is a spectrum of IP use and re-use, of course. In some cases, it may i... » read more

IP To Meet 2.5D Requirements

By Ann Mutschler - 08 May, 2014 - Comments: 1

The semiconductor industry is still in the early stages of evolution in the realm of 2.5D, but when these devices do come out, the IP used on them will have to be brand new, according to Javier DeLaCruz, senior director of engineering at eSilicon. “The IP causes the biggest risk that you’re going to have in this implementation,” he said. “Everything else in here for making those ASIC... » read more

Productive Clock Domain Crossing Verification

By Kiran Vittal - 08 May, 2014 - Comments: 2

Recently, we were invited to participate in an internal Chips@Cisco event along with other EDA vendors and FPGA providers. Executives from these vendors participated in a panel to discuss the challenges seen by the technology leaders in FPGAs and what it means to the industry. Everyone on the panel agreed that design size and complexity, including clock domains, is continuing to follow Moore’... » read more

Blog Review: April 16

By Ed Sperling - 16 Apr, 2014 - Comments: 0

Cadence’s Richard Goering attended a workshop on “extreme” scale design automation, which looked at where else EDA tools can be used—such as intelligent traffic lights. At least there are well-defined use cases. Mentor’s Nazita Saye has compiled five predictions from the 1964 New York World’s Fair that are worth revisiting. Three of them came true. Check out the ones that didn’... » read more

Power Moves Up To First Place

By Ed Sperling - 10 Apr, 2014 - Comments: 2

Virtually every presentation delivered about semiconductor design or manufacturing these days—and every end product specification that uses advanced technology—incorporates some reference to power and/or energy. It has emerged as the most persistent, most problematic, and certainly the most talked about issue from conception to marketplace adoption. And the conversation only grows louder... » read more

Can RTL Power Estimation Accuracy Be Improved?

By Mark Baker - 10 Apr, 2014 - Comments: 0

The power targets for today’s complex SoC designs force design teams to address power optimization earlier and more effectively than ever before. In recent years, design teams have migrated to RTL power estimation solutions to identify areas of potential power savings to be used in early design tradeoffs. RTL power estimation accuracy at 15% to 20% to gate-level power numbers is deemed accept... » read more

Pain Management

By Ed Sperling - 10 Apr, 2014 - Comments: 0

In part one of this series, the focus was on overlapping and new pain points in the semiconductor flow, from initial conception of what needs to be in a chip all the way through to manufacturing. Part two looks at how companies are attempting to manage that pain. It’s no secret that [getkc id="81" kc_name="SoC"]s are getting more complicated to design, debug and build, but the complexity i... » read more

Tech Talk: Debugging IP

By Ed Sperling - 03 Apr, 2014 - Comments: 0

Just because IP is standard doesn't mean it will function as expected in a complex SoC. Ravindra Aneja, senior technical marketing manager at Atrenta, looks at what needs to be done to make sure everything works together. [youtube vid=wlDabbrF2zU] » read more

Blog Review: March 19

By Ed Sperling - 19 Mar, 2014 - Comments: 0

ARM’s Diya Soubra has discovered an interesting term in relation to the Internet of Things: Compound Applications. Will that make the IoT more compelling? Mentor’s Colin Walls points to some less obvious reasons for choosing a processor. No. 4 on his list is particularly noteworthy. Synopsys’ Mick Posner has some thoughts about wearable computing prototypes. Check out the top pho... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Atrenta