Chip Industry Week In Review


Imec announced a new automotive chiplet consortium to evaluate which different architectures and packaging technologies are best for automotive applications. Initial members includes Arm, ASE, Cadence, Siemens, Synopsys, Bosch, BMW, Tenstorrent, Valeo, and SiliconAuto. Imec also launched star, a global network bringing together automotive and semiconductor innovators to address technological c... » read more

The Week In Review: Manufacturing


Mask and fab equipment Seeking to speed up the semiconductor design and manufacturing process, D2S has rolled out its fifth-generation computational design platform (CDP). D2S, a supplier of GPU-accelerated computational systems or platforms, said the latest CDP is designed to enable faster simulations for a range of applications. Using Nvidia’s Pascal-based Tesla P40 GPUs, D2S’ fifth-... » read more