tag: Automated Optical Inspection

Using Deep Learning ADC For Defect Classification For Automatic Defect Inspection
By Onto Innovation - 14 May, 2024 - Comments: 0

In traditional semiconductor packaging, manual defect review after automated optical inspection (AOI) is an arduous task for operators and engineers, involving review of both good and bad die. It is hard to avoid human errors when reviewing millions of defect images every day, and as a result, underkill or overkill of die can occur. Automatic defect classification (ADC) can reduce the number of... » read more

Using Automatic Defect Classification To Reduce The Escape Rate Of Defects
By Bryce Chi - 09 Apr, 2024 - Comments: 0

Automated optical inspection (AOI) is a cornerstone in semiconductor manufacturing, assembly and testing facilities, and as such, it plays a crucial role in yield management and process control. Traditionally, AOI generates millions of defect images, all of which are manually reviewed by operators. This process is not only time-consuming but error prone due to human involvement and fatigue, whi... » read more

Deep Learning For Corner Fill Inspection
By Nordson Test And Inspection - 08 Feb, 2024 - Comments: 0

When automated optical inspection (AOI) works, it is almost always preferable to human visual inspection. It can be faster, more accurate, more consistent, less expensive, and it never gets tired. But there are some challenging applications. Some tasks that are very simple for humans are quite difficult for machines. Object detection is an example. Given an image containing a cat, a dog and a d... » read more

Challenges Grow For Creating Smaller Bumps For Flip Chips
By Anne Meixner - 18 May, 2023 - Comments: 0

New bump structures are being developed to enable higher interconnect densities in flip-chip packaging, but they are complex, expensive, and increasingly difficult to manufacture. For products with high pin counts, flip-chip [1] packages have long been a popular choice because they utilize the whole die area for interconnect. The technology has been in use since the 1970s, starting with IBM�... » read more

Automated Optical Inspection
By Ed Sperling - 07 Nov, 2022 - Comments: 0

Building good automated models for inspection require more data to be collected, both good and bad. Vijay Thangamariappan, R&D engineer at Advantest, explains how to develop models for automating optical inspection, using a multi-thousand pin socket as an example for how machine learning has helped reduce the return rate due to defects from 2% down to zero. He also explains how to achieve t... » read more

Deep Learning Delivers Fast, Accurate Solutions For Object Detection In The Automated Optical Inspection Of Electronic Assemblies
By Charlie Zhu - 07 Dec, 2021 - Comments: 0

When automated optical inspection (AOI) works, it is almost always preferable to human visual inspection. It can be faster, more accurate, more consistent, less expensive, and it never gets tired. However, some tasks that are very simple for humans are quite difficult for machines. Object detection is an example. For example, shown an image containing a cat, a dog, and a duck, a human can insta... » read more

Fabs Drive Deeper Into Machine Learning
By Anne Meixner - 07 Sep, 2021 - Comments: 0

Advanced machine learning is beginning to make inroads into yield enhancement methodology as fabs and equipment makers seek to identify defectivity patterns in wafer images with greater accuracy and speed. Each month a wafer fabrication factory produces tens of millions of wafer-level images from inspection, metrology, and test. Engineers must analyze that data to improve yield and to reject... » read more

NanoResolution MRS Sensor Delivers Fast, Precise 3D Inspection And Measurement For Advanced Semiconductor Packaging Applications
By CyberOptics - 08 Jun, 2020 - Comments: 0

The semiconductor packaging industry continues to advance, with new designs adding more layers, finer features and more I/O channels to achieve faster connections, higher bandwidth and lower power consumption. As packaging technologies have evolved, manufacturers have adapted old processes and adopted new processes to connect chips to each other and to the outside world. Often these new process... » read more

Inspection And Metrology Of Micro LED Technology
By CyberOptics - 10 Feb, 2020 - Comments: 0

Micro LEDs developed using Rohinni’s technology can be deployed in consumer electronics devices, automotive applications and outdoor signage, among other applications. The disruptive technology enables products that are brighter, thinner, lighter and more dynamic that those currently on the market, with lower power consumption than LCD or OLED. Rohinni needed an inspection and metrology so... » read more

Test In New Frontiers: Flexible Circuits
By Susan Rambo - 12 Nov, 2019 - Comments: 0

Test is becoming increasingly complicated as new technologies such as flexible electronics begin playing mission-critical roles in applications where electronics have little or no history. Although flexible circuitry has been around for while, testing needs to catch up as these circuits are deployed across a variety of markets where conditions may be extreme. In many cases, sensors for monit... » read more

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