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GaN 8Gbps High-Speed Relay MMIC For Automated Test Equipment


An 8 Gbps high-speed relay MMIC for an Automated Test Equipment (ATE) using a gallium nitride is developed and evaluated. Metal-Insulator-Semiconductor structure with a tantalum oxynitride is employed to reduce a leakage current for ATE applications. The fabricated MMIC shows 0.3 nA of the leakage current, 12 GHz of a -3 dB bandwidth, and excellent eye-opening of 8 Gbps signals with a 18-lead... » read more

Over-The-Air (OTA) Test Socket And Handler Integration Technology For 5G Mass Production Testing


This paper presents the integration of socket, measurement antenna and handler for over-the-air (OTA) testing of antenna-in-package (AiP) devices using automated test equipment (ATE) for 5G applications. The design and characteristics of sockets for performing OTA testing in the radiating near field are also discussed. The paper also describes the structure of OTA handler integration using thes... » read more

High-Speed Image Processing By GPU


By using CPU and GPU together, we have increased the speed of the filter function that is often used in imaging tests. This feature is provided by the Image Processing Library (IPL) in T2000 CMOS Image Sensor Solution. Next IPE, our new image processing engine that is currently in development, is about six times faster than IPE3 (Image Processing Engine 3), an existing engine. Author: Chiezo... » read more

Development Of High Voltage General-Purpose Pin-Electronics


Currently, there is a demand in Automated Test Equipment (ATE) to test both high-speed/low-voltage amplitude devices manufactured in advanced processes and low-speed / high-voltage amplitude devices manufactured in legacy processes by a pin-electronics equipment. However, it is difficult to achieve both the operating speed over than 1Gbps and the wide I/O range over than 10Vpp, due to the trade... » read more

Testing AiP Modules In High-Volume Production


Far-field and radiating near-field are two options for high-volume over-the-air (OTA) testing of antenna-in-package (AiP) modules with automated test equipment (ATE) [1]. In this article, we define an AiP device under test (DUT) and examine the measurement results from both methods. Creating an AiP evaluation vehicle Proper evaluation of an ATE OTA measurement setup requires an AiP module. Us... » read more

Metrology at Automated Test Equipment Manufacturers


New technologies require an efficient qualification infrastructure to determine and qualify technical specifications. Metrology is the science which determines the acknowledged specification setting process based on proven international standards. This paper describes metrology and its role and benefits in automated test equipment business. By Piotr Skwierawski and Ralf Haefner. Click her... » read more

Silicon Photonics Begins To Make Inroads


Integrating photons and electrons on the same die is still a long way off, but advances in packaging and improvements in silicon photonics are making it possible to use optical communication for a variety of new applications. Utilizing light-based communication between chips, or in self-contained modules, ultimately could have a big impact on chip design. Photons moving through waveguides ar... » read more

Gaps Emerge In Automotive Test


Demands by automakers for zero defects over 18 years are colliding with real-world limitations of testing complex circuitry and interactions, and they are exposing a fundamental disconnect between mechanical and electronic expectations that could be very expensive to fix. This is especially apparent at leading-edge nodes, where much of the logic is being developed for AI systems and image se... » read more

Lab-To-Fab Testing


Test equipment vendors are working on integrating testing and simulation in the lab with testing done later in the fab, setting the stage for what potentially could be the most significant change in semiconductor test in years. If they are successful, this could greatly simplify design for test, which has become increasingly difficult as chips get more complex, denser, and as more heterogene... » read more

Auto Chip Design, Test Changes Ahead


The automotive industry’s unceasing demand for performance, coupled with larger and more complex processors, are driving broad changes in how electronics are designed, verified and tested. What's changing is that these systems, which include AI-oriented logic developed at the most advanced process nodes, need to last several times longer than traditional IT and consumer devices, and they n... » read more

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