Qualifying The ExposedPad TQFP For AEC-Q006 Grade 0

By Amkor - 15 Sep, 2021 - Comments: 0

Semiconductor packages used in various vehicle applications require high reliability. As technological innovations in the automotive market increase, the demand for highly reliable packaging is increasing for applications in autonomous driving, human interfaces, electric vehicles (EVs), hybrid electric vehicles (HEVs) and more. Package reliability is essential because automotive packages must p... » read more

Adding Value With Unit Level Traceability (ULT) In Automotive Packaging

By Amkor - 20 May, 2021 - Comments: 0

Automotive product traceability has existed in one form or another for several decades. Traceability generally refers to tracking and tracing each component that comprises every subsystem in a car. Traditionally, this has been achieved with direct part marking on mechanical or electronic components, using 1D or 2D barcodes or radio-frequency identification (RFID). Since vehicle recalls are cost... » read more

Side Wettable Flanks For Leadless Automotive Packaging

By Amkor - 21 Oct, 2020 - Comments: 0

The MicroLeadFrame (MLF)/Quad Flat No-Lead (QFN) packaging solution is extremely popular in the semiconductor industry. It is used in applications ranging from consumer electronics and communications to those requiring high reliability performance, such as the automotive industry. The wide acceptance of this packaging design is primarily due to its flexible form factors, size, scalability and t... » read more

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tag: automotive packaging

Qualifying The ExposedPad TQFP For AEC-Q006 Grade 0

Adding Value With Unit Level Traceability (ULT) In Automotive Packaging

Side Wettable Flanks For Leadless Automotive Packaging

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