tag: automotive

Safety, Security, And Reliability Of AI In Autos
By Ed Sperling - 22 Feb, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about security, aging, and safety in automotive AI systems, with Geoff Tate, CEO of Flex Logix; Veerbhan Kheterpal, CEO of Quadric; Steve Teig, CEO of Perceive; and Kurt Busch, CEO of Syntiant. What follows are excerpts of that conversation, which was held in front of a live audience at DesignCon. Part one of this discussion is he... » read more

Best Practices For Cybersecurity-Aware SoC Development With ISO 21434
By Synopsys - 22 Feb, 2023 - Comments: 0

The growth of electronics in cars is exposing a new vector for cyberattacks on owners and automotive companies’ reputations. The potential human cost of an attack on the car’s electronics is driving urgency in the adoption of cybersecurity-aware practices, from OEMs and Tier 1s to every component supplier in the automotive industry. The standard “ISO/SAE 21434:2021 Road vehicles — Cyber... » read more

Automotive MCUs: Digital Twin of the LBIST Functionality
By Technical Paper Link - 15 Feb, 2023 - Comments: 0

A new technical paper titled "A Novel LBIST Signature Computation Method for Automotive Microcontrollers using a Digital Twin" was written by researchers at Infineon Technologies, University of Bremen, and DFKI GmbH. Abstract "LBIST has been proven to be an effective measure for reaching functional safety goals for automotive microcontrollers. Due to a large variety of recent innovative fea... » read more

AI’s Impact In Automobiles Remains Uncertain
By Ed Sperling - 15 Feb, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about software updates in cars, where AI makes sense, and why there's a growing sense of optimism, with Geoff Tate, CEO of Flex Logix; Veerbhan Kheterpal, CEO of Quadric; Steve Teig, CEO of Perceive; and Kurt Busch, CEO of Syntiant. What follows are excerpts of that conversation, which were held in front of a live audience at Desi... » read more

Research Bits: Feb. 14
By Susan Rambo - 14 Feb, 2023 - Comments: 0

Defining Kagome superconductors An international team of scientists and researchers from the Brown University lab are now able to describe the structure of the superconductor Kagome metals. The team used nuclear magnetic resonance (NMR) imaging and a quantum modeling theory to describe the microscopic structure as the metal changed states into a charge density wave (CDW) state at 103°Kelvin (... » read more

Simulating Reality: The Importance Of Synthetic Data In AI/ML Systems For Radar Applications
By Arien Sligar - 09 Feb, 2023 - Comments: 0

Artificial intelligence and machine learning (AI/ML) are driving the development of next-generation radar perception. However, these AI/ML-based perception models require enough data to learn patterns and relationships to make accurate predictions on new, unseen data and scenarios. In the field of radar applications, the data used to train these models is often collected from real-world meas... » read more

Maintaining Vehicles Of The Future
By proteanTecs - 08 Feb, 2023 - Comments: 0

Driving a scalable, consumer-centric vision in the mobility industry, vehicles of thefuture will always be connected and differentiated by software. Advancements in software, hardware and their interaction are expanding the boundaries of performance, providing the foundation for next-generation cars. But the same technology that will make this vision a reality also presents new challenges. O... » read more

Bump Reliability is Challenged By Latent Defects
By Karen Heyman - 07 Feb, 2023 - Comments: 0

Thermal stress is a well-known problem in advanced packaging, along with the challenges of mechanical stress. Both are exacerbated by heterogenous integration, which often requires mingling materials with incompatible coefficients of thermal expansion (CTE). Effects are already showing up and will likely only get worse as package densities increase beyond 1,000 bumps per chip. “You comb... » read more

Ramping Up IC Predictive Maintenance
By Anne Meixner - 07 Feb, 2023 - Comments: 0

The chip industry is starting to add technology that can predict impending failures early enough to stave off serious problems, both in manufacturing and in the field. Engineers increasingly are employing in-circuit monitors embedded in SoC designs to catch device failures earlier in the production flow. But for ICs in the field, data tracing from design to application use only recently has ... » read more

Automotive Growing In 2023
By Ann Mutschler - 02 Feb, 2023 - Comments: 0

Automotive has to be one of the most fascinating industries where semiconductors and the semiconductor ecosystem are making huge strides. From the evolution of increasingly autonomous vehicles, to more immersive driver and passenger comfort and infotainment experiences, along with additional safety-related features, it’s a rich development environment. I recently had the opportunity to dis... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy