Revolutionizing Automotive Development For The Digital Future

By Synopsys - 08 Jan, 2020 - Comments: 0

For years, the automotive industry has warned of the impending challenges posed by electrification, autonomous technologies, vehicle-to-everything connectivity, and the uncertain evolution of vehicle ownership. Today, these individual technological leaps, and the ultimate industry revolution they comprise, no longer represent uncomfortable uncertainties, but extremely real and daunting challeng... » read more

EDA, IP Growth Surge

By Ed Sperling - 07 Jan, 2020 - Comments: 1

EDA and IP grew 8.9% in Q3 of 2019, according to a just-released report, indicating continued confidence in semiconductor growth. Total revenue was up 8.9% globally compared with the same period in 2018, but that number is deceptively low. Revenue in China, for example, increased 5.7% compared to the same quarter in 2018, despite trade restrictions on sales of any IP developed in the United ... » read more

Week In Review: IoT, Automotive & Security

By Susan Rambo - 03 Jan, 2020 - Comments: 0

Internet of Things Qorvo, the company whose products sent pictures back from Pluto and Arrokoth (formerly Ultima Thule) on New Horizons, is showing off a couple smart home, IoT products at CES 2020 in Las Vegas next week. The company says its new transceiver chip QPG7015M will simplify gateway IoT design because the chip can simultaneously handle all open, smart home protocols, including ZigBe... » read more

What Engineers Are Reading And Watching

By Brian Bailey - 26 Dec, 2019 - Comments: 0

By Brian Bailey And Ed Sperling An important indicator of where the chip industry is heading is what engineers are reading and what videos they are watching. While some subjects remain on top, such as the level of interest in the latest manufacturing technologies, other areas come and go. The stories with the biggest traffic numbers are almost identical to last year. Readers want to know wh... » read more

Week In Review: IoT, Automotive, Security

By Susan Rambo - 20 Dec, 2019 - Comments: 0

Automotive/Mobility Synopsys and Porsche Consulting, a management consultancy that grew out of Porsche’s automotive expertise, have collaborated on a framework for accelerating the development of automotive SoCs, using automotive IP. The process includes Synopsys' Triple Shift-Left — a which uses virtual prototyping and automotive IP to test software and hardware in the design stage — an... » read more

Crossed Wires On Domains

By Brian Bailey - 19 Dec, 2019 - Comments: 1

Clock, power and reset domains can form a tangled web if systems are not architected correctly. Wires that cross these domains often require special treatment and additional analysis. They are all evolving independently, meaning that designers must keep up with the latest methodology guidelines and tool capabilities to ensure problems do not remain hidden until they get exposed in silicon. C... » read more

What Worked, What Didn’t In 2019

By Brian Bailey - 19 Dec, 2019 - Comments: 1

2019 has been a tough year for semiconductor companies from a revenue standpoint, especially for memory companies. On the other hand, the EDA industry has seen another robust growth year. A significant portion of this disparity can be attributed to the number of emerging technology areas for semiconductors, none of which has reached volume production yet. Some markets continue to struggle, a... » read more

Testing Autonomous Vehicles

By Ed Sperling - 16 Dec, 2019 - Comments: 0

Jeff Phillips, head of automotive marketing at National Instruments, talks about how to ensure that automotive systems are reliable and safe, how test needs to shift to adapt to continual updates and changes, and why this is particularly challenging in a world where there is no known right answer. » read more

How To Ensure Reliability

By Ed Sperling - 13 Dec, 2019 - Comments: 0

Michael Schuldenfrei, corporate technology fellow at OptimalPlus, talks about how to measure quality, why it’s essential to understand all of the possible variables in the testing process, and why outliers are no longer considered sufficient to ensure reliability. » read more

A New Dawn For IP

By Brian Bailey - 12 Dec, 2019 - Comments: 0

The IP industry is changing again. The concept started as build once, use everywhere, but today it is more like architect once, customize everywhere. Few designs can afford sub-optimal IP for their application. The need for customized IP is driven by both leading-edge designs and the trailing markets, although for different reasons. While this customization is causing IP companies to transfo... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?