Blog Review: Dec. 20

By Jesse Allen - 20 Dec, 2017 - Comments: 0

Mentor's Andrew Macleod points out five things that need to happen for autonomous and electric cars to move from R&D and test cases to mass-produced, commercially viable vehicles. Synopsys' Iain Singleton provides some tips on tackling large designs with formal and how the assume-guarantee technique helps split them without masking bugs. Cadence's Paul McLellan shares updates from the... » read more

At The Intersection Of Electronics And Automobiles

By Judy Davies - 11 Dec, 2017 - Comments: 0

While we’re idling at this traffic light, let’s “blue sky” a bit. Over the course of a year, the average American driver spends the equivalent of more than seven 40-hour work weeks just sitting in a car. Crazy, right? But who measures work weeks as only 40 hours anymore? Those 280+ hours spent driving means there’s a lot of non-productive overhead time, to borrow a term from semi... » read more

Look Ma, No Hands! Functional Safety From The Driver’s Seat

By McKenzie Ross - 26 Oct, 2017 - Comments: 0

Every so often, I undertake a project that reminds me why I love working in semiconductor marketing. Back in August, I hopped behind the wheel of a Tesla Model X to film a video for OneSpin about how formal verification can help designers to satisfy the ISO 26262 automotive safety standard. If you haven't yet seen the video, you can watch it here: http://bit.ly/2ycK5Yp The Model X itself was... » read more

5 Big Under-The-Hood Engineering Challenges In Building Autonomous Vehicles

By Puneet Sinha - 03 Aug, 2017 - Comments: 0

Stories about autonomous vehicles are regular fare in the tech news cycle and usually include forecasts about the eventual ascendancy of self-driving cars. The Boston Consulting Group, for example, says that by 2035, 25% of all cars will have partial or full autonomy, with total global sales growing from near-zero levels in 2015 to $42 billion in 2025 and ~ $77 billion by 2035. In short few ye... » read more

Data Storage Issues Grow For Cars

By Ann Mutschler - 02 Feb, 2017 - Comments: 0

Adding safety features into cars and making them increasingly autonomous are rapidly creating a big data problem. More sensors produce more data, which has to be processed, moved, and ultimately stored somewhere in those vehicles. Exactly how that will be achieved isn't quite clear yet. However, there is plenty of discussion on that topic—and for good reason. A new 2017 car will genera... » read more

Perspectives on the Future of Mobility from SAE World Congress 2016

By Andrew Macleod - 05 May, 2016 - Comments: 2

The discussions rage on, and I'm not talking about any election banter, which is growing tiresome. (I’ll note here that election cycles back home in the U.K. last just a month or so.) I’m talking about the future of mobility, the way you and I get around in the world — a hot topic last month at SAE World Congress. Along with much of the rest of the automotive engineering community, I w... » read more

Quality And Safety In Automotive Electronics: Venturing beyond ISO-26262

By Bernard Murphy - 03 Sep, 2015 - Comments: 1

By Bernard Murphy and Jim Hogan Rumors of ‘Project Titan’, the Apple Car, are making the rounds. True or not, when we hear Apple touted as a potential automaker, it’s clear how pervasively electronic content has invaded our cars. A 2013 National Auto Dealers Association report graded electronic content at 15% of auto-buying decision factors, impressive growth from close to zero only... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

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Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.