Week In Review: Design, Low Power

By Jesse Allen - 22 Apr, 2022 - Comments: 0

Tools & IP Synopsys unveiled a new neural processing unit (NPU) IP and toolchain. DesignWare ARC NPX6 NPU IP scales from 4K to 96K MACs with power efficiency of 30 TOPS/Watt. A single instance offers 250 TOPS at 1.3 GHz on 5nm processes in worst-case conditions, or up to 440 TOPS by using new sparsity features, which can increase the performance and decrease energy demands of executing a n... » read more

Design For Airborne Electronics

By Ann Mutschler - 03 Feb, 2020 - Comments: 0

The Next Generation Air Transportation System (NextGen), an FAA-led modernization of America's air transportation system meant to make flying more efficient, predictable and safer, is currently underway as one of the most ambitious infrastructure projects in U.S. history. This is not just a minor upgrade to an aging infrastructure. The FAA and partners are in the process of implementing new ... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 05 Oct, 2018 - Comments: 0

Internet of Things Amazon Web Services announced that Iridium Communications has joined the AWS Partner Network. AWS and Iridium have collaborated on development of Iridium CloudConnect, a service that enables worldwide coverage for Internet of Things applications through Iridium’s satellite network. AWS IoT is being paired with Iridium IoT services as a result. IHS Markit forecasts there wi... » read more

Manufacturing Bits: July 25

By Mark LaPedus - 25 Jul, 2017 - Comments: 0

Metrology for the intelligence community The semiconductor industry continues to move full speed ahead with traditional chip scaling. There are several challenges in the arena. One of the big but lessor known challenges is metrology. Metrology, the science of characterizing and measuring films and structures, is becoming more complex, challenging and expensive at each node. Looking to solv... » read more

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Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: BAE Systems

Week In Review: Design, Low Power

Design For Airborne Electronics

Week in Review: IoT, Security, Auto

Manufacturing Bits: July 25

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Knowledge Centers
Entities, people and technologies explored