One Chip Vs. Many Chiplets

By Ed Sperling - 20 Nov, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss the growing list of challenges at advanced nodes and in advanced packages, with Jamie Schaeffer, vice president of product management at GlobalFoundries; Dechao Guo, director of advanced logic technology R&D at IBM; Dave Thompson, vice president at Intel; Mustafa Badaroglu, principal engineer at Qualcomm; and Thomas Ponnusw... » read more

Integration Challenges For RISC-V Designs

By Ed Sperling - 27 Feb, 2024 - Comments: 0

One of the big draws of RISC-V is that it allows design teams to create unique chips or chiplets and to make modifications to the instruction-set architecture. That extra degree of freedom also creates some issues when it comes to integrating those designs into packages or systems because they may require non-standard connectivity approaches. Frank Schirrmeister, vice president of marketing at ... » read more

DSP Techniques For High-Speed SerDes

By Ed Sperling - 23 Oct, 2023 - Comments: 0

Sensors everywhere, more connected devices, and the rollout of smart everything has created a flood of data. The question now is how to best handle all of that data, where to process it, and how to move it locally and to the outside network. Madhumita Sanyal, technical product manager at Synopsys, talks about the need for continuous performance improvements in SerDes, PCIe, NRZ, and PAM4, and w... » read more

How Sub-THz Will Impact the Future Of 6G

By Alejandro Escobar Calderon - 30 May, 2023 - Comments: 0

By Alejandro Escobar Calderon and Gerardo Orozco The world is more connected than ever before and, while this notion isn’t new, many of us fail to fully grasp at times the magnitude of connection growth speed. As of 2022, the world had around 13.2B IoT connections (Ericsson Mobile) with a YoY growth of 13%. Additionally, mobile network data traffic has doubled every two years since 2019. T... » read more

CXL Memory: Detailed Characterization Analysis Using Micro-Benchmarks And Real Applications (UIUC, Intel Labs)

By Technical Paper Link - 30 Mar, 2023 - Comments: 0

A new technical paper titled "Demystifying CXL Memory with Genuine CXL-Ready Systems and Devices" was published by researchers at University of Illinois Urbana-Champaign (UIUC) and Intel Labs. Abstract: "The high demand for memory capacity in modern datacenters has led to multiple lines of innovation in memory expansion and disaggregation. One such effort is Compute eXpress Link (CXL)-based... » read more

Dealing With Performance Bottlenecks In SoCs

By Brian Bailey - 23 Feb, 2023 - Comments: 0

A surge in the amount of data that SoCs need to process is bogging down performance, and while the processors themselves can handle that influx, memory and communication bandwidth are straining. The question now is what can be done about it. The gap between memory and CPU bandwidth — the so-called memory wall — is well documented and definitely not a new problem. But it has not gone away... » read more

Boosting Data Center Memory Performance In The Zettabyte Era With HBM3

By Frank Ferro - 08 Dec, 2022 - Comments: 0

We are living in the Zettabyte era, a term first coined by Cisco. Most of the world’s data has been created over the past few years and it is not set to slow down any time soon. Data has become not just big, but enormous! In fact, according to the IDC Global Datasphere 2022-2026 Forecast, the amount of data generated over the next 5 years will be at least 2x the amount of data generated over ... » read more

HBM3 In The Data Center

By Ed Sperling - 17 Oct, 2022 - Comments: 0

Frank Ferro, senior director of product management at Rambus, talks about the forthcoming HBM3 standard, why this is so essential for AI chips and where the bottlenecks are today, what kinds of challenges are involved in working with this memory, and what impact chiplets and near-memory compute will have on HBM and bandwidth. » read more

Novel In-Pixel-in-Memory (P2M) Paradigm for Edge Intelligence (USC)

By Technical Paper Link - 24 Aug, 2022 - Comments: 0

A new technical paper titled "A processing-in-pixel-in-memory paradigm for resource-constrained TinyML applications" was published by researchers at University of Southern California (USC). According to the paper, "we propose a novel Processing-in-Pixel-in-memory (P2M) paradigm, that customizes the pixel array by adding support for analog multi-channel, multi-bit convolution, batch normaliza... » read more

Review of Bumpless Build Cube Using Wafer-on-Wafer & Chip-on-Wafer for Tera-Scale 3D Integration

By Technical Paper Link - 20 Jun, 2022 - Comments: 0

New research paper titled "Review of Bumpless Build Cube (BBCube) Using Wafer-on-Wafer (WOW) and Chip-on-Wafer (COW) for Tera-Scale Three-Dimensional Integration (3DI)" from researchers at Tokyo Institute of Technology and others. Abstract "Bumpless Build Cube (BBCube) using Wafer-on-Wafer (WOW) and Chip-on-Wafer (COW) for Tera-Scale Three-Dimensional Integration (3DI) is discussed. Bum... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?