Inferencing At The Edge

By Ed Sperling - 04 Jun, 2019 - Comments: 0

Geoff Tate, CEO of Flex Logix, talks about the challenges of power and performance at the edge, why this market is so important from a business and technology standpoint, and what factors need to be balanced. » read more

Latency Under Load: HBM2 vs. GDDR6

By Ed Sperling - 09 May, 2019 - Comments: 0

Steven Woo, Rambus fellow and distinguished inventor, explains why data traffic and bandwidth are critical to choosing the type of DRAM, options for improving traffic flow in different memory types, and how this works with multiple memory types. Related Video GDDR6 - HBM2 Tradeoffs Why designers choose one memory type over another. Applications for each were clearly delineate... » read more

The Promise Of GDDR6 And 7nm

By Frank Ferro - 14 Feb, 2019 - Comments: 1

Research Nester, a market research and consulting firm, estimates that the “global market of computer graphics may witness a remarkable growth and reach at the valuation of $215.5 billion by the end of year 2024.” Plus, it says this market is expected to grow at a significant compound annual growth rate or CAGR of 6.1% over the forecast period 2017 to 2024. Computer graphics is just the ... » read more

3 Big Challenges For 5G

By Ed Sperling - 06 Sep, 2018 - Comments: 0

The general assumption is that we will all be walking around with 5G phones in our pockets someday, but 5G devices may look more like a home router, a car, or maybe even a tablet than a smart phone. There are three main problems that need to be solved here. The big one is coverage, and that gets confusing because it depends on which version of 5G people are talking about. There are at least ... » read more

High-Speed SerDes At 7nm

By Ed Sperling - 30 Jul, 2018 - Comments: 0

eSilicon’s David Axelrad discusses the challenges with 56Gbps and 112Gps SerDes, and why the switch from analog to digital is required for performance and low power. https://youtu.be/E-CU8TLvjjc » read more

IoT Wireless Battles Ahead

By Brian Bailey - 18 Jun, 2018 - Comments: 0

"The good thing about standards is that there are so many to choose from." – Andrew S. Tanebaum The extended version of that quote adds "furthermore, if you do not like any of them, you can just wait for next year's model." That could not be truer when it comes to IoT and wireless connectivity. Every standards group is rushing to create new versions of existing standards that use less p... » read more

Tech Talk: 5G Everywhere

By Ed Sperling - 11 Jun, 2018 - Comments: 0

Sarah Yost, senior product marketing manager at National Instruments, talks about the promise of 5G, where it works and where it doesn’t work, and why it’s so critical for so many different markets. https://youtu.be/CzxdrrhSvGY » read more

Power/Performance Bits: May 29

By Jesse Allen - 29 May, 2018 - Comments: 0

Using bandwidth like a fish Researchers from the University of Georgia developed a method to make fuller use of wireless bandwidth, inspired by a cave-dwelling fish's jamming avoidance response. Eigenmannia fish live in complete darkness, sensing their environment and communicating through emitting an electric field. When two fish emit signals at similar frequencies they can interfere with ... » read more

Tech Talk: Shrink Vs. Package

By Ed Sperling - 10 May, 2018 - Comments: 0

Andy Heinig, group manager for system integration at Fraunhofer EAS, talks about the tradeoffs between planar design and advanced packaging, including different types of interposers, chiplets and thermal issues. https://youtu.be/1BDqgCujJno » read more

Driving By Ethernet

By Ann Mutschler - 01 Feb, 2018 - Comments: 0

The race to add more sophisticated and safety-critical electronics into cars is forcing carmakers to revisit the communications systems within increasingly electrified and connected vehicles. Until very recently, communication between components within a vehicle was simplistic, and communication between vehicles was non-existent. All of that is changing quickly. Rapid and secure communicatio... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: bandwidth