From Medical And Wearables To Big Data

By eSilicon - 25 Mar, 2015 - Comments: 0

Whether it’s a tiny always-on medical device or a secure cloud network processing Big Data, the Internet of Things is bringing new challenges to IC design. This white paper provides techniques and IP examples for managing IoT’s power and bandwidth demands. To read more, click here. » read more

Rethinking The Cloud

By Ed Sperling - 12 Mar, 2015 - Comments: 0

Data center architectures have seen very few radical changes since the commercial introduction of the [getentity id="22306" comment="IBM"] System/360 mainframe in 1964. There have been incremental improvements in speed and throughput over the years, with a move to a client/server model in the 1990s, but from a high level this is still an environment where data is processed and stored centrally ... » read more

Where The IoT Money Will Be

By Ernest Worthman - 05 Mar, 2015 - Comments: 0

As we get closer and closer to figuring out what the Internet of Things—or increasingly, the Internet of Everything (IoE)—will and won’t be, one of the themes that shows up regularly is exactly how to monetize it. “A large portion of marketing dollars are wasted when the wrong offers are made to the wrong people at the wrong place and time,” notes Jon Gettinger Sr. vice president o... » read more

Rethinking Big Data

By Ernest Worthman - 10 Nov, 2014 - Comments: 0

You have to marvel at the sheer genius of what modern day, edge-of-the envelope marketing schemes can accomplish. For example, terms such as the [getkc id="76" comment="Internet of Things"], (also referred to as the Cloud of Things, or the Internet of Everything, or even Internet of Interconnect) have become sexy, interesting, exciting camouflage layers over the rather dull M2M industry. The... » read more

Big Data In The Fab

By Michael Watts - 16 Oct, 2014 - Comments: 0

A modern fab is a very complicated place, with a huge amount of information required to correctly process wafers. But even more data is created to characterize the equipment and wafers. The idea is if there is complete knowledge of the fab then everything should be predictable, including yield, and running it an optimal fashion is possible. The challenges with big data all revolve around co... » read more

I Have Seen The Future

By Mike Gianfagna - 25 Sep, 2014 - Comments: 0

We recently concluded an online survey that measured design challenges and general sentiment regarding how they can be addressed, with some specific forward-looking queries. The title of the survey was “Big Data, the Cloud and Internet of (Silicon) Things.” We essentially asked our survey respondents to look into the future. We got an excellent response to this survey, with lots of thoughtf... » read more

Chip Manufacturing Data Now Requires Cloud Techniques

By Kenji Tsuda - 09 Dec, 2013 - Comments: 0

The parameters in semiconductor manufacturing are growing so large that an analysis method similar to what’s currently used for big data is now required. The good news is that big data analysis techniques, which process a vast amount of data such as search data and communication logs in the cloud, is entirely applicable to the data of semiconductor process. Photo 1: Opening view of AEC... » read more

Taking Aim At Big Data

By Ed Sperling - 25 Apr, 2013 - Comments: 0

By Ed Sperling As the Internet of Things bridges the gap between the mobile and big data worlds, EDA and IP vendors increasingly are looking well beyond their usual boundaries. How successful they are at moving upward into a market that is far less price-sensitive remains to be seen. But from a technology standpoint, at least, the issues encountered by data centers and cloud providers are ... » read more

Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

Defining The Chiplet Socket

The industry may have started with the wrong approach for enabling a third-party chiplet ecosystem, but who will step in and fix it?

by Brian Bailey

tag: big data

From Medical And Wearables To Big Data

Rethinking The Cloud

Where The IoT Money Will Be

Rethinking Big Data

Big Data In The Fab

I Have Seen The Future

Chip Manufacturing Data Now Requires Cloud Techniques

Taking Aim At Big Data

Trending Articles

NAND Flash Targets 1,000 Layers

Testing For Thermal Issues Becomes More Difficult

Auto Chip Aging Accelerates In Hot Climates

Is In-Memory Compute Still Alive?

Top-Down Vs. Bottom-Up Chiplet Design

Knowledge Centers
Entities, people and technologies explored