Smart Irrigation System Using Periodic Advertisement With Response (PAwR) Feature Of Bluetooth Low Energy

By Advait Kulkarni - 05 Dec, 2024 - Comments: 0

With an ever-growing market of IoT and Industry 4.0 applications, a need for newer features arises to support these applications. The latest Infineon chip CYW20829 boasts a set of new features suitable for a multitude of these IoT applications. These features include Periodic Advertisements with Response (PAwR), low energy long-range (LE-LR), 2M PHY layer, etc. These features offer a novel pe... » read more

Big Future In A Small Space: Wireless SoCs Enable Wearable Medical And Wellness Devices To Realize Their Potential

By David Renno - 02 Jul, 2024 - Comments: 0

By David Renno, David Armour, Melissa Hu, and Sezgi Koukourakis The technology of personal medical monitoring is changing incredibly fast. As little as ten years ago, the normal way that a patient would keep track of general health indicators, such as heart rate and blood pressure, or specific indicators such as blood glucose, was through an invasive medical procedure such as a blood test. S... » read more

Key Inflection Points Influencing Bluetooth Low Energy Sourcing Decisions

By Charles Dittmer - 04 Jan, 2024 - Comments: 0

Bluetooth 5.4, the latest specification from the Bluetooth Special Interest Group (SIG), includes a number of enhancements that will open additional markets and use cases. This is one of several inflection points in the Bluetooth Low Energy (BLE) market that we will discuss in this blog. One thing I have learned over the course of my career in delivering multiple wireless products is that th... » read more

Brokerage System for Integration of LrWPAN Technologies

By Technical Paper Link - 01 Apr, 2022 - Comments: 0

New academic paper from UK's Leeds Beckett University. Abstract "The prevalent demand for remote data sharing and connectivity has catalysed the development of many wireless network technologies. However, low-power and low-rate wireless network technologies have emerged as the preferred choice (due to cheap procurement and maintenance cost, efficiency, and adaptability). Currently, these gr... » read more

Hybrid System-Level Test For RF SiP

By Koji Miyauchi - 08 Jun, 2021 - Comments: 0

In recent years, the proliferation of the IoT has focused attention on low-power-wireless applications. IoT modules incorporating functions such as Bluetooth Low Energy (BLE) transceivers, MCUs, and power-management circuitry are becoming system-in-package (SiP) and even one-chip devices. Such devices increase the demand for a mass-production test environment that can measure them in a short ti... » read more

Wireless Power Market Heats Up

By Bryon Moyer - 26 Aug, 2020 - Comments: 2

The wireless power market is in flux as established technologies meet newer approaches. Old standards battles have simmered somewhat, but competing messages remain. What the public ends up using will depend heavily on public charging infrastructure, but the stakes are significant. The market for battery chargers is forecast to reach $25B by 2022. Most of those chargers plug into the wall, bu... » read more

Bluetooth LE Audio Makes Its Debut

By Shewan Yitayew - 27 Feb, 2020 - Comments: 0

The Bluetooth Low Energy 5.2 specification introduces LE audio, which is a significant step forward for Bluetooth audio, both in terms of sounds quality and functionality. LE Audio, based on our new iEB110 IP, will enable manufacturers to create low power audio devices that offer several revolutionary new features that weren’t possible before, even with third-party proprietary solutions. T... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 31 Jan, 2020 - Comments: 0

AI/Edge Brewer Science is introducing its first material for permanent bond used in assembling ICs, image sensor devices, and MEMS for devices and packaging that “include low-temperature bonding, extreme chemical resistance, UV or thermal curable bonding process, and no material movement after cure,” according to a press release. The bond is part of the PermaSOL product family. “These hi... » read more

Big Growth Areas: Connectivity, AI, Reliability

By Brian Bailey - 14 Jan, 2020 - Comments: 0

Connectivity and artificial intelligence (AI) will be the biggest drivers for 2020, with an emphasis on improved reliability across all areas. New standards, new applications, and new pressures being placed on old technology will created boundless opportunities for those ready to fill the need. Of course, there will also be a lot of carnage along the way, and we can expect to see a lot of that ... » read more

The Power Of Integrating Bluetooth Low Energy Into SoCs

By Synopsys - 15 Jul, 2019 - Comments: 0

The Bluetooth Low Energy (BLE) specification, released in 2011, enables designers of System-on-Chips (SoCs) to maximize the battery life of IoT devices and minimize the implementation costs of wireless sensors and other “connected things” by maximizing sleep time and simplifying Radio operation. Because it is built on the established ecosystem of Bluetooth Classic for mobile phones and P... » read more

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Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.