Big Future In A Small Space: Wireless SoCs Enable Wearable Medical And Wellness Devices To Realize Their Potential

By David Renno - 02 Jul, 2024 - Comments: 0

By David Renno, David Armour, Melissa Hu, and Sezgi Koukourakis The technology of personal medical monitoring is changing incredibly fast. As little as ten years ago, the normal way that a patient would keep track of general health indicators, such as heart rate and blood pressure, or specific indicators such as blood glucose, was through an invasive medical procedure such as a blood test. S... » read more

The Proliferation Of Bluetooth In V2X Automotive Applications

By Charles Dittmer - 01 Feb, 2024 - Comments: 0

V2X, or “Vehicle to Everything,” applies to wireless communication between a vehicle and a specific entity or network. Although vehicle-to-vehicle communication projects can be traced back to the 1970s, more recently the IEEE WLAN V2X specifications released in 2010 and the 3GPP V2X specification published in 2016 have defined specific wireless standards for V2X communications. Most of the ... » read more

Key Inflection Points Influencing Bluetooth Low Energy Sourcing Decisions

By Charles Dittmer - 04 Jan, 2024 - Comments: 0

Bluetooth 5.4, the latest specification from the Bluetooth Special Interest Group (SIG), includes a number of enhancements that will open additional markets and use cases. This is one of several inflection points in the Bluetooth Low Energy (BLE) market that we will discuss in this blog. One thing I have learned over the course of my career in delivering multiple wireless products is that th... » read more

Brokerage System for Integration of LrWPAN Technologies

By Technical Paper Link - 01 Apr, 2022 - Comments: 0

New academic paper from UK's Leeds Beckett University. Abstract "The prevalent demand for remote data sharing and connectivity has catalysed the development of many wireless network technologies. However, low-power and low-rate wireless network technologies have emerged as the preferred choice (due to cheap procurement and maintenance cost, efficiency, and adaptability). Currently, these gr... » read more

Smart Home Device Communication In The Era Of Hyperconnectivity

By Frank Schirrmeister - 24 Jun, 2021 - Comments: 0

In our increasingly hyperconnected world, a fascinating area to watch is what I would call "the last 100 feet, give or take." There are many standards like Wi-Fi, Bluetooth, Zigbee, or Thread used for IoT device connectivity. There are very active discussions about how our smart devices should be allowed to talk to other resources, like our neighbor's Wi-Fi. In the IoT's municipal and industria... » read more

Hybrid System-Level Test For RF SiP

By Koji Miyauchi - 08 Jun, 2021 - Comments: 0

In recent years, the proliferation of the IoT has focused attention on low-power-wireless applications. IoT modules incorporating functions such as Bluetooth Low Energy (BLE) transceivers, MCUs, and power-management circuitry are becoming system-in-package (SiP) and even one-chip devices. Such devices increase the demand for a mass-production test environment that can measure them in a short ti... » read more

Bluetooth LE Audio Makes Its Debut

By Shewan Yitayew - 27 Feb, 2020 - Comments: 0

The Bluetooth Low Energy 5.2 specification introduces LE audio, which is a significant step forward for Bluetooth audio, both in terms of sounds quality and functionality. LE Audio, based on our new iEB110 IP, will enable manufacturers to create low power audio devices that offer several revolutionary new features that weren’t possible before, even with third-party proprietary solutions. T... » read more

Week In Review: IoT, Security, Autos

By Susan Rambo - 10 Jan, 2020 - Comments: 0

Internet of Things Sensors that see in the dark, look deep into our faces and hear the impossible, were all part of ams’ CES lineup this week. ams announced that it has designed an advanced spectral ambient light sensor (ALS) for high-end mobile phone cameras. The ALS, called the AS7350, identifies the light source and makes an accurate white balance under low-light and other non-ideal condi... » read more

Week in Review: IoT, Security, Autos

By Jeff Dorsch - 23 Aug, 2019 - Comments: 0

Products/Services Huawei Technologies is again delaying the public introduction of its Mate X foldable smartphone. It is unlikely the product will be marketed in the U.S., given the ongoing trade war. The official rollout now seems likely to come in November, in time for the holiday shopping season. Samsung Electronics has had its problems with foldable phones, yet those were due to manufactur... » read more

The Power Of Integrating Bluetooth Low Energy Into SoCs

By Synopsys - 15 Jul, 2019 - Comments: 0

The Bluetooth Low Energy (BLE) specification, released in 2011, enables designers of System-on-Chips (SoCs) to maximize the battery life of IoT devices and minimize the implementation costs of wireless sensors and other “connected things” by maximizing sleep time and simplifying Radio operation. Because it is built on the established ecosystem of Bluetooth Classic for mobile phones and P... » read more

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Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

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Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Bluetooth Low Energy