Small Molecule Analysis Testing: Liquid Chromatography Versus Gas Chromatography


Chromatography is a process for separating components of a mixture for analysis. This is a component of our small molecule analysis testing and plays a critical part in identifying and quantifying impurities. It is also crucial in screening raw materials for identification, to ensure the quality and safety of products, as well as evaluate reactions by looking at residual analytes to better unde... » read more

High-Temperature Stable Spin-On Carbon Materials For Advanced Pattern Transfer Applications


In recent years a strong demand has arisen for spin-on carbon (SOC) materials compatible with high-temperature processes. This requirement is to enable usage of high-temperature SOC (HTSOC) materials in integration schemes utilizing chemical vapor deposition (CVD) and/or atomic layer deposition (ALD) processes. In addition to compatibility with the high-temperature deposition processes, planari... » read more

Week In Review: Manufacturing, Test


GlobalFoundries launched GF Labs, an “open framework of internal and external research and development initiatives that deliver a differentiated pipeline of market-driven process technology solutions for future data-centric, connected, intelligent and secure applications.” Greg Bartlett, GF's senior vice president of technology, engineering at quality, said the goal is to develop and exp... » read more

Reducing Greenhouse Gases In Manufacturing


Businesses must reduce their environmental impact. One of the most significant ways to do this is by reducing their carbon footprint, and this starts with monitoring carbon emissions. Carbon emissions are responsible for 81% of overall greenhouse gas (GHG) emissions, and businesses are responsible for a lot of it. The rest of the GHG emissions are methane (10%), nitrous oxide (7%) and fluorin... » read more

Study Of Bondable Laser Release Material Using 355nm Energy To Facilitate RDL-First And Die-First Fan-Out Wafer-Level Packaging (FOWLP)


A thorough evaluation on selecting a bondable laser release material for redistribution layer (RDL)-first and die-first fan-out wafer-level packaging (FOWLP) is presented in this article. Four laser release materials were identified based on their absorption coefficient at 355 nm. In addition, all four of these materials possess thermal stability above 350 °C and pull-off adhesion on a Ti/Cu l... » read more

Digitalizing Water Monitoring


Managing water resources has always been important, but that monitoring is becoming increasingly high-tech and much more useful. Rather than a spot check at the tap, or a crude measurement of water levels in a reservoir, chips are making it possible to monitor and measure water quantity and quality at the source, wherever it is stored, the spigot, and in the wastewater systems. As climate ch... » read more

Big Changes In Materials And Processes For IC Manufacturing


Rama Puligadda, CTO at Brewer Science, sat down with Semiconductor Engineering to talk about a broad set of changes in semiconductor manufacturing, packaging, and materials, and how that will affect reliability, processes, and equipment across the supply chain. SE: What role do sacrificial materials play in semiconductor manufacturing, and how is that changing at new process nodes? Puliga... » read more

5 Traits For Healthy Competition


Competition encourages continuous improvement. Therefore, to enable growth, surround yourself with others who aspire to be better. This fundamental concept is most notably quoted in Proverbs 27:17, “iron sharpens iron,” interpreted as when both people are committed to growth, they recognize challenges as opportunities, not obstacles. Competitive people are found everywhere. The competiti... » read more

A Single-Layer Mechanical Debonding Adhesive For Advanced Wafer-Level Packaging


Better performance and lower cost are always key trends being pursued in the semiconductor industry. Moore's law has provided a very well-defined relationship between performance and cost and the semiconductor industry has followed this law for the past several decades with no issue. However, it became more and more difficult for foundries and integrated device manufacturers (IDMs) to scale to ... » read more

Week In Review: Manufacturing, Test


The U.S. Senate approved the 2022 America COMPETES act, which has big ramifications for the chip industry. The bill now heads to the House for further reconciliation. If approved, it would provide more than $50 billion in U.S. subsidies for semiconductor chip manufacturing. The SIAC (Semiconductor In America Coalition) urged Congress to act promptly to achieve a bipartisan compromise soon and o... » read more

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