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Chip Package Co-design and Physical Verification for Heterogeneous Integration


Abstract: "Physical verification of components in 2.5D and 3D integrated chips is challenging because existing tool flows have evolved from monolithic silicon design. These components are typically designed on separate technology nodes nearly independent of each other and integrated along the design cycle. We developed an integration and verification methodology with a physical design driven... » read more

Containing Design Complexity With POP IP


About 25 years ago, Carver Mead, one of the pioneers of VLSI design, told a technical audience then grappling with the complexities of quarter-micron design that he could see an evolutionary path to about 130nm, but after that point, the picture blurred. Flash forward to the present and we’re manufacturing SoCs at 7nm, and the output is truly amazing devices powering applications we and Me... » read more