tag: Broadcom

Can Formal Replace Simulation?
By Brian Bailey - 01 May, 2017 - Comments: 1

A year ago, [getentity id="22147" comment="Oski Technology"] achieved something that had never happened before. It brought together 15 of the top minds in [getkc id="33" kc_name="formal verification"] deployment and sat them down in a room to discuss the problems and issues they face and the ways in which they are attempting to solve those problems. Semiconductor Engineering was there to record... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 31 Mar, 2017 - Comments: 0

Chipmakers At an event, Intel’s Technology and Manufacturing group outlined the company's vision. As part of the event, Intel reiterated what many are saying—the current node designations are meaningless and misleading. “For example, Intel estimates that its 14nm solution that has been out in the market since 2014 should be equal to 10nm solutions released by competitors in the near futu... » read more

Challenges Grow For IP Reuse
By Ann Mutschler - 23 Mar, 2017 - Comments: 3

As chip complexity increases, so does the complexity of IP blocks being developed for those designs. That is making it much more difficult to re-use IP from one design to the next, or even to integrate new IP into an SoC. What is changing is the perception that standard [getkc id="43" kc_name="IP"] works the same in every design. Moreover, well-developed [getkc id="100" kc_name="methodologie... » read more

Worst-Case Results Causing Problems
By Ed Sperling - 09 Mar, 2017 - Comments: 0

The ability of design tools to identify worst-case scenarios has allowed many chipmakers to flag potential issues well ahead of tapeout, but as process geometries shrink that approach is beginning to create its own set of issues. This is particularly true at 16/14nm and below, where extra circuitry can slow performance, boost the amount of power required to drive signals over longer, thinne... » read more

What Can Be Cut From A Design?
By Ann Mutschler - 09 Feb, 2017 - Comments: 0

A long-standing approach of throwing everything into a chip increasingly is being replaced by a focus on what can be left out it. This shift is happening at every level, from the initial design to implementation. After years of trying to fill every square nanometer of real estate on a piece of silicon with memory and logic, doubling the number of [getkc id="26" kc_name="transistors"] from on... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 20 Jan, 2017 - Comments: 0

Chipmakers 2017 is just getting underway and there appears to be more restructuring in the IC industry. Toshiba is looking to spin off its semiconductor division and Western Digital (WD) plans to take a minority stake, according to Nikkei, which added that Toshiba would sell a 20% stake for 200-300 billion yen ($1.78-$2.65 billion). “The arrangement would provide Toshiba with short term fund... » read more

The Power And Limits Of Money
By Gale Morrison - 11 Jan, 2017 - Comments: 0

[getperson id="11694" p_name="Wally Rhines"], CEO of [getentity id="22017" e_name="Mentor Graphics"], sat down with Semiconductor Engineering to discuss how semiconductor engineering teams make their dollars work even when budgets are limited. The issue is as important as ever, given the industry's unrelenting margin and cost pressure and the growing competition for top talent. What follows are... » read more

Looking Back On IoT In 2016
By Jeff Dorsch - 05 Jan, 2017 - Comments: 0

The Internet of Things was going great guns for most of 2016. Until October 21, that is. That’s the date of the coordinated cyberattacks on Dyn, an Internet performance management services firm. The distributed denial-of-service attacks quickly had impacts on Airbnb, Amazon, Facebook, Netflix, PayPal, Reddit, Twitter, and other popular websites. Dyn was able to fight off the aggressive att... » read more

CEO Outlook: Chip Design 2017
By Ed Sperling - 22 Dec, 2016 - Comments: 0

After two consecutive flat to slightly down years, the semiconductor industry is poised for growth in 2017. Cowan this month predicted 4.7% growth in semiconductor sales in 2017, while World Semiconductor Trade Statistics (WSTS) put that figure at 3.3%. And last month, International Business Strategies (IBS) pegged the number at 4.6%, according to statistics compiled by the Global Semiconduc... » read more

Chip Advances Play Big Role In Cloud
By Gale Morrison - 12 Dec, 2016 - Comments: 0

Semiconductor engineering teams have been collaborating with key players in the data center ecosystem in recent years, resulting in unforeseen and substantial changes in how data centers are architected and built. That includes everything from which boxes, boards, cards and cables go where, to how much it costs to run them. The result is that bedrock communication technology and standards li... » read more

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