tag: Bruker

Empowering Universities By Retaining Raman Knowledge
By Inga Koehler - 09 Jan, 2024 - Comments: 0

A big chunk of precious research funds spent on an expensive piece of equipment, for example a Raman microscope. Now, such a magnificent piece of hardware can seem quite intimidating. After all, it could be capable of building a spaceship! Now a poor graduate student must face copious amounts of training, becoming a real expert over the span of 3 to 4 years. Mostly because the professor ... » read more

Chip Industry Week In Review
By The SE Staff - 05 Jan, 2024 - Comments: 0

By Susan Rambo, Jesse Allen, and Liz Allan The U.S. government will provide about $162 million in federal incentives, under the CHIPS and Science Act, to help Microchip onshore its semiconductor supply chain. The move is aimed at securing a reliable domestic supply of MCUs and mature-node chips. “Today’s announcement will help propel semiconductor manufacturing projects in Colorado and O... » read more

Closing The Test And Metrology Gap In 3D-IC Packages
By Gregory Haley - 12 Dec, 2023 - Comments: 0

The industry is investing in more precise and productive inspection and testing to enable advanced packages and eventually, 3D ICs. The next generations of aerospace, automotive, smartphone, and wearable tech most likely will be powered by multiple layers of intricately connected silicon, a stark departure from the planar landscapes of traditional integrated circuits. These 3D-ICs, compos... » read more

Applying ML In Failure Analysis
By Anne Meixner - 20 Nov, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss how increasing complexity in semiconductor and packaging technology is driving shifts in failure analysis methods, with Frank Chen, director of applications and product management at Bruker Nano Surfaces & Metrology; Mike McIntyre, director of product management in the Enterprise Business Unit at Onto Innovation; Kamran H... » read more

New Insights Into IC Process Defectivity
By Laura Peters - 07 Nov, 2023 - Comments: 1

Finding critical defects in manufacturing is becoming more difficult due to tighter design margins, new processes, and shorter process windows. Process marginality and parametric outliers used to be problematic at each new node, but now they are persistent problems at several nodes and in advanced packaging, where there may be a mix of different technologies. In addition, there are more proc... » read more

DRAM Test And Inspection Just Gets Tougher
By Anne Meixner - 07 Nov, 2023 - Comments: 0

DRAM manufacturers continue to demand cost-effective solutions for screening and process improvement amid growing concerns over defects and process variability, but meeting that demand is becoming much more difficult with the rollout of faster interfaces and multi-chip packages. DRAM plays a key role in a wide variety of electronic devices, from phones and PCs to ECUs in cars and servers ins... » read more

Tiny Dots, Big Impact: The Luminous World of Quantum Dots
By Xia Stammer - 07 Nov, 2023 - Comments: 0

In the early ’80s, Alexey Ekimov and Louis E. Brus independently researched semiconductor clusters, leading to the discovery of quantum dots (QDs). QDs are nanoscale semiconductor particles with unique optical and electronic properties. In 1993, Moungi Bawendi improved quantum dot production, making them nearly perfect for various applications. By the late ’90s and early 2000s, quantum d... » read more

Isolating Critical Data In Failure Analysis
By Anne Meixner - 01 Nov, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss traceability and the lack of data needed to perform root cause analysis with Frank Chen, director of applications and product management at Bruker Nano Surfaces & Metrology; Mike McIntyre, director of product management in the Enterprise Business Unit at Onto Innovation; Kamran Hakim, ASIC reliability engineer at Teradyne... » read more

Wirebonding Is Here To Stay
By Gregory Haley - 19 Oct, 2023 - Comments: 0

Few technologies in semiconductor manufacturing have stood the test of time as steadfastly as wirebonding. This process, which involves electrically connecting semiconductor devices to their packages, has been a cornerstone of the electronics industry since the beginning of the electronics industry. Like everything else in the semiconductor market, wirebonding technologies have changed over ... » read more

Using Smart Data To Boost Semiconductor Reliability
By Laura Peters - 10 Oct, 2023 - Comments: 0

The chip industry is looking to AI and data analytics to improve yield, operational efficiency, and reduce the overall cost of designing and manufacturing complex devices. In fact, SEMI estimates its members could capture more than $60B in revenues associated through smart data use and AI. Getting there, however, requires overcoming a number of persistent obstacles. Smart data utilization is... » read more

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