Mapping Silicon Valley’s Changes


Silicon Valley is changing again, this time in ways no one would have predicted a decade ago. The Valley has a long history of reinventing itself, and to some extent redefining the boundaries of exactly what constitutes Silicon Valley. The core of the Valley started out producing electronic components primarily for the military and then large electronics companies in the 1970s. The actual te... » read more

Time For Change


Semiconductor companies have been knocking on doors outside of the computer industry for the better part of two decades, pitching the value of digital and mixed-signal technology for improving efficiency in many market sectors. For most of that time, they received polite nods, occasional inquiries for more information and not much else. But over the past several years, those doors have open... » read more

Device Adequateness


There is a growing chorus of people who are saying that 2016 will be, quite frankly, a boring technology year. They talk about no new or exciting products coming along. They talk about a lack of imagination, a lack of new product categories and quite a few failed categories from the past couple of years, such as wearables. It all comes down to the fact that products have not managed to make us ... » read more

Industry Road Map Under Construction


While most engineers think in terms of PPA—the classic power, performance and area tradeoffs—their bosses tend to see the world in terms of risk vs. opportunity. Until 22nm, these two objectives moved forward at roughly the same pace, despite the growing technical challenges of fitting more functionality into an SoC. Much has changed since then, and even more will change over the next f... » read more

Bridging Hardware And Software


Methodology and reuse are two fairly standard concepts when it comes to semiconductor design, but they're viewed completely differently by hardware and software teams. It's a given that hardware and software have different goals and opinions about how best to do design. And while all agree that a single methodology can pay dividends in future chips, there is disagreement over who should shap... » read more

Thinking Outside The Chip


Intel will begin adding 2.5D and 3D packaging into its processors, following the lead set by IBM and AMD in recognizing that new packaging approaches are essential for improving performance and lowering power. This shift won't derail the semiconductor industry's efforts to the reach future process nodes or continually shrink features, but it does add context for other factors that in... » read more

Predictions For 2016: Markets


Seventeen companies sent in their predictions for this year with some of them sending predictions from several people. This is in addition to the CEO predictions that were recently published. That is a fine crop of views for the coming year, especially since they know that they will be held accountable for their views and this year, just like the last, they will have to answer for them. We beli... » read more

Equipment Sales Were Mixed Bag In 2015


Semiconductor equipment billings were up in Q3 of 2015, the most recent statistics available from SEMI, compared with Q3 of 2014. The strongest growth was reported in China, which grew 63%, and Taiwan, which was up 22%. Billings in North America were down 23%, while in Korea they were down 22%. Europe was down 36%. Japan was up 2%, which is consistent with the growth seen in recent EDA C... » read more

Executive Insight: Sehat Sutardja


Sehat Sutardja, chairman and CEO of Marvell, sat down with Semiconductor Engineering to talk about new approaches for design and memory and why costs and time to market are forcing changes in Moore's Law. What follows are excerpts of that conversation. SE: What was behind your move into modular packaging? Sutardja: The cost of building chips is getting out of hand. As we make things more ... » read more

What Goes Wrong With IP


Semiconductor Engineering sat down to talk about the future of IP with Rob Aitken, R&D fellow at [getentity id="22186" comment="ARM"]; Mike Gianfagna, vice president of marketing at [getentity id="22242" e_name="eSilicon"]; Judd Heape, vice president of product applications at Apical; and Bernard Murphy, an independent industry consultant. What follows are excerpts of that discussion, which... » read more

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