Zonal Architectures Play Key Role In Vehicle Security


The automotive ecosystem is starting to shift toward zonal architectures, making vehicle functionality less dependent on the underlying hardware and allowing more flexibility in what gets processed where. The impact of that shift is both broad and significant. For carmakers, it could lead to hardware consolidation and more options for failovers in case something goes wrong with any system in... » read more

What Is An xPU?


Almost every day there is an announcement about a new processor architecture, and it is given a three-letter acronym — TPU, IPU, NPU. But what really distinguishes them? Are there really that many unique processor architectures, or is something else happening? In 2018, John L. Hennessy and David A. Patterson delivered the Turing lecture entitled, "A New Golden Age for Computer Architecture... » read more

Changing Server Architectures In The Data Center


Data centers are undergoing a fundamental shift to boost server utilization and improve efficiency, optimizing architectures so available compute resources can be leveraged wherever they are needed. Traditionally, data centers were built with racks of servers, each server providing computing, memory, interconnect, and possibly acceleration resources. But when a server is selected, some of th... » read more

Energy-Efficient SoCs For The Zettabyte Era Using Power-Saving IP And System Design Techniques


As the modern world becomes increasingly connected, businesses and consumers alike are relying more and more on digital data. Behind the scenes, data centers that manage all of this digital data are a somewhat silent, yet impactful, part of this connectivity revolution. These data centers are lined with servers that process digital data for everything from social media status updates to analyti... » read more

RF/Microwave Technology Driving The Connected Car


In-car networks and advanced driver-assistance systems (ADAS), made possible through wireless sensors, driver-assist radar, vehicle communications, and related electronics, present many design challenges to engineers. Simulation software enables design teams to effectively manage the complex design and integration challenges associated with developing these high-speed and RF-enabled networks. T... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive The automotive chip shortage is still affecting automotive OEMs. U.S. automakers Ford and GM reported lower 3rd quarter income year over year related to the chip shortage. They, as well as other automotive OEMs around the world, have had to temporarily shut assembly lines down when chips were not available. Infineon Technologies signed a memorandum of understanding with Hyundai M... » read more

What’s Next For Emulation


Emulation is now the cornerstone of verification for advanced chip designs, but how emulation will evolve to meet future demands involving increasingly dense, complex, and heterogeneous architectures isn't entirely clear. EDA companies have been investing heavily in emulation, increasing capacity, boosting performance, and adding new capabilities. Now the big question is how else they can le... » read more

Partitioning For Better Performance And Power


Partitioning is becoming more critical and much more complex as design teams balance different ways to optimize performance and power, shifting their focus from a single chip to a package or system involving multiple chips with very specific tasks. Approaches to design partitioning have changed over the years, most recently because processor clock speeds have hit a wall while the amount of d... » read more

High-Level Synthesis For RISC-V


High-quality RISC-V implementations are becoming more numerous, but it is the extensibility of the architecture that is driving a lot of design activity. The challenge is designing and implementing custom processors without having to re-implement them every time at the register transfer level (RTL). There are two types of high-level synthesis (HLS) that need to be considered. The first is ge... » read more

3D-IC Design Challenges And Requirements


As demands accelerate for increasing density, higher bandwidths, and lower power, many IC design and packaging teams are taking a close look at vertical stacking multiple chips and chiplets. This technology, called 3D-IC, promises many advantages over traditional single-die planar designs. Some are using the term “More-than-Moore” to describe the potential of this new technology. Integratio... » read more

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