tag: Cadence Design Systems

What’s Next For Emulation
By Brian Bailey - 28 Oct, 2021 - Comments: 1

Emulation is now the cornerstone of verification for advanced chip designs, but how emulation will evolve to meet future demands involving increasingly dense, complex, and heterogeneous architectures isn't entirely clear. EDA companies have been investing heavily in emulation, increasing capacity, boosting performance, and adding new capabilities. Now the big question is how else they can le... » read more

Partitioning For Better Performance And Power
By Ann Mutschler - 28 Oct, 2021 - Comments: 0

Partitioning is becoming more critical and much more complex as design teams balance different ways to optimize performance and power, shifting their focus from a single chip to a package or system involving multiple chips with very specific tasks. Approaches to design partitioning have changed over the years, most recently because processor clock speeds have hit a wall while the amount of d... » read more

High-Level Synthesis For RISC-V
By Brian Bailey - 28 Oct, 2021 - Comments: 2

High-quality RISC-V implementations are becoming more numerous, but it is the extensibility of the architecture that is driving a lot of design activity. The challenge is designing and implementing custom processors without having to re-implement them every time at the register transfer level (RTL). There are two types of high-level synthesis (HLS) that need to be considered. The first is ge... » read more

3D-IC Design Challenges And Requirements
By Cadence - 27 Oct, 2021 - Comments: 0

As demands accelerate for increasing density, higher bandwidths, and lower power, many IC design and packaging teams are taking a close look at vertical stacking multiple chips and chiplets. This technology, called 3D-IC, promises many advantages over traditional single-die planar designs. Some are using the term “More-than-Moore” to describe the potential of this new technology. Integratio... » read more

Get Ready For The Next Generation Of Wearable Tech
By Brian Bailey - 18 Oct, 2021 - Comments: 0

Wearables have attracted a lot of attention recently, due to both their successes as well as failures. They bring together requirements for packaging, new substrates, power scavenging, low-power, novel connectivity, flexibility, durability, as well as fashion. While some of the challenges remain formidable, the long-term potential is driving the industry to look at what is possible. They are... » read more

HBM3: Big Impact On Chip Design
By Ann Mutschler - 14 Oct, 2021 - Comments: 0

An insatiable demand for bandwidth in everything from high-performance computing to AI training, gaming, and automotive applications is fueling the development of the next generation of high-bandwidth memory. HBM3 will bring a 2X bump in bandwidth and capacity per stack, as well as some other benefits. What was once considered a "slow and wide" memory technology to reduce signal traffic dela... » read more

Architecting Interposers
By Brian Bailey - 14 Oct, 2021 - Comments: 0

An interposer performs a similar function as a printed circuit board (PCB), but when the interposer is moved inside a package the impact is significant. Neither legacy PCB nor IC design tools can fully perform the necessary design and analysis tasks. But perhaps even more important, adding an interposer to a design may require organizational changes. Today, leading-edge companies have shown ... » read more

Rising Fortunes For ICs In Health Care
By SE Staff - 13 Oct, 2021 - Comments: 0

Semiconductors are increasingly finding their way into a variety of medical devices, after years of slow growth and largely consumer electronics types of applications. Nearly every major chipmaker has a toehold in health care these days, and many are starting to look beyond wearable such as the Apple Watch to devices that can be relied on for accuracy and reliability. Unlike in the past, the... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 08 Oct, 2021 - Comments: 0

Automotive Qualcomm and SSW Partners, an investment partnership, now have a definitive agreement to acquire advanced driver assistance systems (ADAS) company Veoneer for $37.00 per share in an all-cash transaction that equals $4.5 billion in equity value. A few months ago, Qualcomm made the proposal to Veoneer after the company already had an agreement in place with Magma, a 60-year-old automo... » read more

Competing Auto Sensor Fusion Approaches
By Bryon Moyer - 07 Oct, 2021 - Comments: 0

As today’s internal-combustion engines are replaced by electric/electronic vehicles, mechanical-system sensors will be supplanted by numerous electronic sensors both for efficient operation and for achieving various levels of autonomy. Some of these new sensors will operate alone, but many prominent ones will need their outputs combined — or “fused” — with the outputs of other sensor... » read more

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