3D PCB Design And Analysis: ECAD/MCAD And Where They Converge


The design of a board and its ‘home’ are heavily interdependent. They require careful consideration to ensure everything will be in working order when your product is ultimately brought to market. Many designs have been derailed by conflicts between ECAD and MCAD. Something as simple as an improperly placed / communicated mounting hole can send your project into a tailspin of re-designs. ... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive The State of California has banned the selling of new vehicles with gasoline-powered internal combustion engines (ICE) by 2035. All new passenger cars sold in 15 years in California will be zero emission cars, according to an executive order signed by the state’s governor. Older ICE passenger cars will still be allowed on the roads and can still be sold as used vehicles. The order... » read more

Have Processor Counts Stalled?


Survey data suggests that additional microprocessor cores are not being added into SoCs, but you have to dig into the numbers to find out what is really going on. The reasons are complicated. They include everything from software programming models to market shifts and new use cases. So while the survey numbers appear to be flat, market and technology dynamics could have a big impact in resh... » read more

5G NR Primer For Amplifier And Filter Design


This primer examines some of the challenges engineers face when designing filters and power amplifiers for 5G New Radio (NR) communication systems. See how the Cadence AWR Design Environment platform can be used to simulate amplifier and filter performance under 5G operating conditions. Click here to continue reading.     » read more

Compiling And Optimizing Neural Nets


Edge inference engines often run a slimmed-down real-time engine that interprets a neural-network model, invoking kernels as it goes. But higher performance can be achieved by pre-compiling the model and running it directly, with no interpretation — as long as the use case permits it. At compile time, optimizations are possible that wouldn’t be available if interpreting. By quantizing au... » read more

How ML Enables Cadence Digital Tools To Deliver Better PPA


Artificial intelligence (AI) and machine learning (ML) are emerging as powerful new ways to do old things more efficiently, which is the benchmark that any new and potentially disruptive technology must meet. In chip design, results are measured in many different ways, but common metrics are power (consumed), performance (provided), and area (required), collectively referred to as PPA. These me... » read more

Week In Review: Auto, Security, Pervasive Computing


AI on edge Cadence’s Tensilica Vision P6 DSP IP will be in Kneron’s KL720, a 1.4TOPS AI system-on-chip (SoC) targeted for AI of things (AIoT), smart home, smart surveillance, security, robotics and industrial control applications. Arm announced its Arm Cortex-R82, a 64-bit, Linux-capable Cortex-R processor for enterprise and computational storage systems. The processor is designed to pr... » read more

Software-Defined Vehicles


Automobiles long ago stopped being purely mechanical systems. But as more components are electrified — and, in particular, as the drivetrain is electrified — cars are becoming software-defined vehicles. Some think of such cars as computers on wheels. But as these systems continue to evolve, adding in more assisted and semi-autonomous capabilities, that comparison is looking increasingly ... » read more

Artificial Intelligence And Machine Learning Add New Capabilities to Traditional RF EDA Tools


This article features contributions from RF EDA vendors on their various capabilities for artificial intelligence and machine learning. AWR Design Environment software is featured and highlights the network synthesis wizard. Click here to continue reading. » read more

Week In Review: Auto, Security, Pervasive Computing


Pervasive computing — data center, edge, IoT SEMI formed a new standards committee to develop global standards for flexible hybrid electronics (FHE). The SEMI Standards Flexible Hybrid Electronics Global Technical Committee will develop FHE standards for design, materials, manufacturing, packaging and systems and to drive industry growth. IPC is also working on FHE standards as an industry s... » read more

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