tag: Cadence Design Systems

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 04 Sep, 2020 - Comments: 0

AI on edge Cadence’s Tensilica Vision P6 DSP IP will be in Kneron’s KL720, a 1.4TOPS AI system-on-chip (SoC) targeted for AI of things (AIoT), smart home, smart surveillance, security, robotics and industrial control applications. Arm announced its Arm Cortex-R82, a 64-bit, Linux-capable Cortex-R processor for enterprise and computational storage systems. The processor is designed to pr... » read more

Software-Defined Vehicles
By Bryon Moyer - 03 Sep, 2020 - Comments: 1

Automobiles long ago stopped being purely mechanical systems. But as more components are electrified — and, in particular, as the drivetrain is electrified — cars are becoming software-defined vehicles. Some think of such cars as computers on wheels. But as these systems continue to evolve, adding in more assisted and semi-autonomous capabilities, that comparison is looking increasingly ... » read more

Artificial Intelligence And Machine Learning Add New Capabilities to Traditional RF EDA Tools
By Cadence - 26 Aug, 2020 - Comments: 0

This article features contributions from RF EDA vendors on their various capabilities for artificial intelligence and machine learning. AWR Design Environment software is featured and highlights the network synthesis wizard. Click here to continue reading. » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 21 Aug, 2020 - Comments: 0

Pervasive computing — data center, edge, IoT SEMI formed a new standards committee to develop global standards for flexible hybrid electronics (FHE). The SEMI Standards Flexible Hybrid Electronics Global Technical Committee will develop FHE standards for design, materials, manufacturing, packaging and systems and to drive industry growth. IPC is also working on FHE standards as an industry s... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 14 Aug, 2020 - Comments: 0

Pervasive computing — data center, edge, IoT Maxim Integrated’s new USB-C Power Delivery products — the MAX77958 USB-C PD controller and the MAX77962 28W buck-boost charger — are aimed at devices, such as IoT or mobile phones, that need more power or for fast charging. To shave time off development and cost when changing from single-cell to two-series cell architectures, these are USB-... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 07 Aug, 2020 - Comments: 0

Pervasive computing — data center, edge, IoT Codasip and Metrics Design Automation announced they have integrated Metrics’ SystemVerilog RTL Simulation Platform within Codasip’s SweRV Core Support Package, version, and it will be accessible on the cloud. Aldec’s TySOM Embedded Development Kits have qualified for Amazon Web Services (AWS) IoT Greengrass. TySOM is a family of Xilinx Z... » read more

Virtualization In The Car
By Ann Mutschler - 06 Aug, 2020 - Comments: 1

As the automotive industry grapples with complexity due to electrification and increasing autonomy of vehicles, consolidation of ECUs within vehicles, more stringent safety and security requirements, automotive ecosystem players are looking to virtualization concepts in a number of ways to realize the vehicles of tomorrow. One way is with hardware virtualization; the ability of a device such... » read more

WiFi Evolves For The IoT
By Bryon Moyer - 06 Aug, 2020 - Comments: 0

WiFi is everywhere, and it’s the most prevalent of the communication protocols that use unlicensed spectrum. But as a common protocol for the Internet of Things (IoT), it faces challenges both because of congestion and the amount of energy it consumes. Two new approaches aim to address those concerns. One is to use multiple channels at once. The second involves the new 802.11ah HaLow stand... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 17 Jul, 2020 - Comments: 0

Arm's parent company, Japanese tech conglomerate Softbank, reportedly is considering a sale or IPO of its Arm subsidiary, which it purchased in 2016 for $32 billion in cash. Considering that Arm chips are in most smart phones, as well as an increasing number of computers and IoT and edge devices, this development is being closely followed by most of the tech world. Last week, Softbank directed ... » read more

Advanced Packaging Makes Testing More Complex
By Bryon Moyer - 07 Jul, 2020 - Comments: 1

The limits of monolithic integration, together with advances in chip interconnect and packaging technologies, have spurred the growth of heterogeneous advanced packaging where multiple dies are co-packaged using 2.5D and 3D approaches. But this also raises complex test challenges, which are driving new standards and approaches to advanced-package testing. While many of the showstopper issues... » read more

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